PCB내 1005 수동소자 내장을 이용한 Diplexer 구현 및 특성 평가
The Fabrication and Characterization of Diplexer Substrate withburied 1005 Passive Component Chip in PCB
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Abstract
Today lots of investigations on Embedded Passive Technology using materials and chip components have been carried out. We fabricated diplexers with 1005 sized-passives, which were made by burying chips in PCB substrate and surface mounting chip on PCB. 6 passive chips (inductors and capacitors) were used for the frequency divisions of 880 MHz~960 MHz(GSM) and 1.71 GHz~1.88 GHz (DCS). Two types of diplxer were characterized with Network analyzer. The chip buried diplexer showed extra 5db loss and a little deviation of 0.6GHz at aimed frequency areas, whereas the chip mounted diplexer showed max. 0.86dB loss within GSM field and max. 0.68dB within DCS field respectively. But few degradations were observed after 260oC for 80min baking and 280oC for 10sec solder floating.
참고문헌 (6)
- "Recent advanced in Low CTE and High Density System-on-a-Package(SOP) Substrate with Thin Film Component Integration", pp.1357~1380 (2006)
- "차세? SoP-L 공정기술 동향", 8(6), pp.7~14 (2005)
- "JPCA SHOW" (2005), CMK Booth, Tokyo
- Sawada, "The reliability of plastic ball grid array package", 15(17), pp.35~39 (1998)
- Lin, "Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering", pp.163~169 (1997)
- 이중근, "Dual band Antenna Switch Module의 LTCC 공정변수에 따른 안정성 및 특성 개선에 관한 연구", 마이크로전자 및 패키징학회지, 12(2), pp.105~109 (2005), 한국마이크로전자및패키징학회