무연 솔더바에 대한 신뢰성 평가기준에 관한 연구
Reliability Appraisal Standard for Lead-free Solder Bar
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Abstract
?The growing environmental regulation governs the use of lead by RoHS, WEEE, and then. The electronic industry is moving to replace Pb-bearing solder with Pb-free solder. To use the Pb-free solder, microelectronic industry needs consequently the new reliability appraisal such as the packaging for high temperature process, various mechanical change caused by new solder, and the development of Pb-free sloder for long life of product. The evaluation of solder bar and mechanical properties of joint were performed compared with international standard, and new appraisal standard was established The solderability and spread ability of Sn-0.7Cu solder material showed up to the standard. Shear test of solder joint using by the solder resulted that the shear strengths after thermal shock or after aging were not much lower than the shear strength of as-soldered and that they were also up to the standard.
참고문헌 (16)
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