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광 패키징 및 인터커넥션 기술

Optical Packaging and Interconnection Technology

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참고문헌

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주제분류재료공학

초록

By the need for high-speed data transmission in PCB, the studies on the optical PCB has been conducted with optical interconnection and its packaging technology. Particularly, the polymer-based optical interconnection has been extensively studied with the advantages such as cost-effective and ease of process. For high-efficiency and passive alignment, the studies were performed using the 45 degree mirrors, MT connector, and etc. In this work, integrated PLC device and fiber alignment array block was fabricated by using imprint technology to solve the alignment and array problem of optical device and the optical fiber. The fabricated integrated block for optical interconnection of PLC device has achieved higher precision of decreasing the dimensional error of the patterns by optimization of process and its insertion loss has an average value of 4.03dB, lower than criteria specified by international standard. In addition, a optical waveguide with built-in lens has been proposed for high-efficiency and passive alignment. By simulation, it was confirmed that the proposed structure has higher coupling efficiency than conventional no-lens structure and has the broad tolerance for the spatial offset of optical waveguide.

Abstract

By the need for high-speed data transmission in PCB, the studies on the optical PCB has been conducted with optical interconnection and its packaging technology. Particularly, the polymer-based optical interconnection has been extensively studied with the advantages such as cost-effective and ease of process. For high-efficiency and passive alignment, the studies were performed using the 45 degree mirrors, MT connector, and etc. In this work, integrated PLC device and fiber alignment array block was fabricated by using imprint technology to solve the alignment and array problem of optical device and the optical fiber. The fabricated integrated block for optical interconnection of PLC device has achieved higher precision of decreasing the dimensional error of the patterns by optimization of process and its insertion loss has an average value of 4.03dB, lower than criteria specified by international standard. In addition, a optical waveguide with built-in lens has been proposed for high-efficiency and passive alignment. By simulation, it was confirmed that the proposed structure has higher coupling efficiency than conventional no-lens structure and has the broad tolerance for the spatial offset of optical waveguide.

참고문헌 (13)

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  2. W. J. Dally, "Transmitter Equalization for 4- Gbps Signaling", IEEE Micro, 17(1), pp.48~ (1997)
  3. 류진화, "광 PCB 및 패키징 기술", 마이크로전자 및 패키징학회지, 18(1), pp.7~13 (2011), 한국마이크로전자및패키징학회
  4. J. T. Kim, "Passive alignment method of polymer PLC devices by using a hot embossing technique", IEEE Photonics Technology Letters, 16(7), pp.1664~1666 (2004), Institute of Electrical and Electronics Engineers
  5. A. Hashim, "Polymer-Based Board-Level Optical Interconnects", Proc. IEEE 2nd International Conference on Photonics (ICP) (2011), IEEE Photonics Society
  6. S. Bernabe, "Chip-to-Chip Optical Interconnections between Stacked Self-Aligned SOI Photonic Chips", Optics Express, 20(7), pp.7886~ (2012)
  7. S. H. Hwang, "Two-dimensional optical interconnection based on two-layered optical printed circuit board", IEEE PHOTONICS TECHNOLOGY LETTERS, 19(5-8), pp.411~413 (2007), IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
  8. W. J. Lee, "Surface Input", Output Optical Splitter Film for Multilayer Optical Circuits, 2012, pp.24(6), 506~
  9. R. C. A. Pitwon, "FirstLight: Pluggable Optical Interconnect Technologies for Polymeric Electro-Optical Printed Circuit Boards in Data Centers", Journal of Lightwave Technology, 30(21), pp.3316~ (2012)
  10. I. K. Cho, "Interchip Link System Using an Optical Wiring Method", Optics Letters, 33(16), pp.1881~ (2008)
  11. J. H. Ryu, "Optical interconnection for a polymeric PLC device using simple positional alignment", OPTICS EXPRESS, 19(9), pp.8571~8579, OPTICAL SOC AMER
  12. 김영섭, "광소자의 광 정렬 및 연결 구조 구현용 임프린트 공정 연구", 한국정밀공학회지, 29(12), pp.1376~1381 (2012), 한국정밀공학회[DOI]
  13. 김동민, "렌즈 일체형 광도파로를 이용한 고효율 수동 광 PCB 접속 구조 설계", 마이크로전자 및 패키징학회지, 19(2), pp.47~53 (2012), 한국마이크로전자및패키징학회[DOI]

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