잉크젯 프린팅된 Cu 박막의 응력해소를 통한 전기적 특성 개선
The Improvement of Electrical Characteristics of Inkjet-printed Cu films with Stress Relaxation during Thermal Treatment
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미래형 유연소자 개발 시 비용감소 및 공정적합성 개선을 위해 동박을 잉크젯 프린팅법을 이용해 공중합체유연기판 상 형성하고, 전기적 특성에 열처리 분위기가 미치는 영향을 확인하기 위해 3 종류의 환원분위기에서 열처리를진행하여 보았다. 그 결과 200도의 낮은 온도에서 환원 특성이 뛰어난 포름산 분위기에서 전도체 수준의 비저항은 얻을수 있었으나, 열처리 시 발생하는 응력으로 인해 발생된 표면균열에 기인해 그 값이 기존 동박에 비해 매우 높았다. 이에비정질재료에서 응용되는 응력해소법을 응용하여 표면균열을 억제한 결과 230도 열처리 시 기존 열처리 방법에서는7.4 μΩcm의 비저항을 보이나, 응력해소를 통한 표면 균열이 억제된 시편에서는 3.4 μΩcm의 비저항 값을 얻을 수 있었다. 특히 등온열처리에 의한 응력해소 효과를 확인하기 위해 동일 온도에서 등온시간 없이 열처리를 진행한 결과, 표면균열이억제되지 못함을 확인할 수 있었다.
Abstract
Using flexible bismaleimide-triazine co-polymer as a substrate, inkjet-printed Cu films were also investigatedfor low-cost and process feasibility of flexible electronics. After annealing at 200oC for 1 h under various reducing ambient,surface color was changed to red and electrical resistivity was decreased to the level of conductor under formic acidambient. However, its resistivity was much higher than conventional copper films due to surface crack. In order to reducethe residual film stress after annealing, additional isothermal treatment was inserted before anneal hiring the stressrelaxation applied in processes of amorphous materials. As a result, no surface crack was observed and electrical resistivityof 3.4 μΩcm was measured after annealing at 230oC with stress relaxation while electrical resistivity of 7.4 μΩcm wasobserved after normal annealing without relaxation. The effect of stress relaxation was also confirmed by observing surfacecrack after decreasing the relaxation time to 0 min.
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