전도성 나노 구리잉크의 잉크젯 프린팅 유변학적 거동 및 광소결 특성 평가
Rheological behavior and IPL sintering properties of conductive nano copper ink using ink-jet printing
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초록
최근 잉크젯 프린팅 기술을 이용한 인쇄전자 분야가 차세대 기술로서 각광받고 있으며, 복수의 프린트 헤드(head)로부터 다양한 잉크 형태의 소재를 정밀하게 출력하여 적층할 수 있는 3D 프린팅 기술에 관한 연구가 활발하게 진행되고 있다. 본 연구에서는 잉크젯 3D 프린팅 기술을 이용하여 광경화성 실리카 잉크와 PVP가 첨가된 나노 구리 잉크로 절연층과 전도층의 복합구조체를 제작하였다. 프린팅 구동 조건과 잉크의 유변학적 거동을 최적화하여 정밀한 광경화 실리카절연층을 적층 제조하였으며, 절연층의 저항은 2.43 × 10¹³ Ω·cm의 값을 나타내었다. 광경화 실리카 절연층 위에는 액적 간격 제어를 통하여 나노 구리 전도층을 프린팅하였다. PVP 첨가 나노 구리 잉크의 소결은 IPL 광소결 공정을 이용하였으며,어닐링 온도와 인가 전압 변화에 따른 전기적, 기계적 특성을 확인하였다. 100°C 어닐링 온도와 700 V IPL 광소결 조건에서 PVP가 첨가된 나노 구리 전도층의 저항은 29 μΩ·cm으로 매우 낮으며, 광경화 실리카 절연층과의 접착력은 매우 우수한 것으로 확인하였다.
Abstract
The printed electronics field using ink-jet printing technology is in the spotlight as a next-generation technology,especially ink-jet 3D printing, which can simultaneously discharge and precisely control various ink materials, has been actively researched in recent years. In this study, complex structure of an insulating layer and a conductive layer was fabricated with photo-curable silica ink and PVP-added Cu nano ink using ink-jet 3D printing technology. A precise photocuredsilica insulating layer was designed by optimizing the printing conditions and the rheological properties of the ink,and the resistance of the insulating layer was 2.43 × 10¹³ Ω·cm. On the photo-cured silica insulating layer, a Cu conductive layer was printed by controlling droplet distance. The sintering of the PVP-added nano Cu ink was performed using an IPL flash sintering process, and electrical and mechanical properties were confirmed according to the annealing temperature and applied voltage. Finally, it was confirmed that the resistance of the PVP-added Cu conductive layer was very low as 29 μΩ·cm under 100°C annealing temperature and 700 V of IPL applied voltage, and the adhesion to the photo-cured silica insulating layer was very good.
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