CNT-Ag 복합패드가 Cu/Au 범프의 플립칩 접속저항에 미치는 영향
Effect of CNT-Ag Composite Pad on the Contact Resistance of Flip-Chip Joints Processed with Cu/Au Bumps
0
조회
0
다운로드
0
인용
0
참고문헌
키워드
초록
이방성 전도접착제를 이용하여 Cu/Au 칩 범프를 Cu 기판 배선에 플립칩 실장한 접속부에 대해 CNT-Ag 복합패드가 접속저항에 미치는 영향을 연구하였다. CNT-Ag 복합패드가 내재된 플립칩 접속부가 CNT-Ag 복합패드가 없는 접속부에 비해 더 낮은 접속저항을 나타내었다. 각기 25 MPa, 50 MPa 및 100 MPa의 본딩압력에서 CNT-Ag 복합패드가 내재된 접속부는 164 mΩ, 141 mΩ 및 132 mΩ의 평균 접속저항을 나타내었으며, CNT-Ag 복합패드를 형성하지 않은 접속부는 200 mΩ, 150 mΩ 및 140 mΩ의 평균 접속저항을 나타내었다.
Abstract
We investigated the effect of CNT-Ag composite pad on the contact resistance of flip-chip joints, which were formed by flip-chip bonding of Cu/Au chip bumps to Cu substrate metallization using anisotropic conductive adhesive. Lower contact resistances were obtained for the flip-chip joints which contained the CNT-Ag composite pad than the joints without the CNT-Ag composite pad. While the flip-chip joints with the CNT-Ag composite pad exhibited average contact resistances of 164 mΩ, 141 mΩ, and 132 mΩ at bonding pressures of 25 MPa, 50 MPa, and 100 MPa, the flip-chip joints without the CNT-Ag composite pad had an average contact resistance of 200 mΩ, 150 mΩ, and 140 mΩ at each bonding pressure.
참고문헌 (26)
- 최정열, "신축성 전자패키징을 위한 CNT-Ag 복합패드에서의 플립칩 공정", 마이크로전자 및 패키징학회지, 20(4), pp.17~23 (2013), 한국마이크로전자및패키징학회[DOI]
- M. Gonzalez, "Thermo-Mechanical Analysis of Flexible and Stretchable Systems", 11th International Conference of Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (Euro- SimE), pp.1~ (2010), Institute of Electrical and Electronics Engineers
- 안종현, "유연 반도체", 메모리 소자 기술, 2013, pp.20(2), 1~9[DOI]
- J. Xiao, "Stretchable and Compressible Thin Films of Stiff Materials on Compliant Wavy Substrates", App. Phys. Lett, 93, pp.013109~ (2008)
- T. Löher, "Stretchable Electronic Systems", Proc. 59th Electronic Components and Technology Conference (ECTC), pp.893~ (2009), IEEE Components, Packaging and Manufacturing Technology Society (CPMT)
- T. Sekitani, "A Rubberlike Stretchable Active Matrix Using Elastic Conductors", Science, 321, pp.1468~ (2008)
- D. H. Kim, "Stretchable and Foldable Silicon Integrated Circuits", Science, 320, pp.507~ (2008)
- M. Gonzalez, "Design of metal interconnects for stretchable electronic circuits", Microelectron. Reliab, 48, pp.825~ (2008)
- T. Sekitani, "Stretchable Active-Matrix Organic Light-Emitting Diode Display Using Printable Elastic Conductors", Nature Mater, 8, pp.494~ (2009)
- J. H. Ahn, "Stretchable Electronics: Materials, Architectures and Integrations", J. Phys. D: Appl. Phys, 45, pp.102001~ (2012)
- D. H. Kim, "Stretchable Electronics: Materials Strategies and Devices", Adv. Mater, 20, pp.4887~ (2008)
- 최정열, "SnBi 저온솔더의 플립칩 본딩을 이용한 스마트 의류용 칩 접속공정", 마이크로전자 및 패키징학회지, 19(3), pp.71~76 (2012), 한국마이크로전자및패키징학회[DOI]
- T. Löher, "Stretchable Electronic Systems", Proc. 8th Electronics Packaging Technology Conference (EPTC), pp.271~ (2006), IEEE Component, Packaging and Manufacturing Technology Society (CPMT)
- S. P. Lacoura, "Stretchable Gold Conductors on Elastomeric Substrates", Appl. Phys. Lett, 82, pp.2404~ (2003)
- K. S. Kim, "Large-Scale Pattern Growth of Graphene Films for Stretchable Transparent Electrodes", Mature Lett, 457, pp.706~ (2009)
- T. S. Hansen, "Highly Stretchable and Conductive Polymer Material Made from Poly(3,4-ethylenedioxythiophene) and Polyurethane Elastomers", Adv. Funct. Mater, 17, pp.3068~ (2007)
- J. A. Rogers, "Materials and Mechanics for Stretchable Electronics", Science, 327, pp.1603~ (2010)
- 하준석, "플립칩 공정시 반응생성물이 계면반응 및 접합특성에 미치는 영향", 마이크로전자 및 패키징학회지, 19(2), pp.35~39 (2012), 한국마이크로전자및패키징학회[DOI]
- 정동명, "칩 실장공정에 따른 Package on Package(PoP)용 하부 패키지의 Warpage 특성", 마이크로전자 및 패키징학회지, 20(3), pp.63~69 (2013), 한국마이크로전자및패키징학회[DOI]
- 최정열, "비전도성 접착제로 국부적으로 둘러싸인 인터록킹 접속구조를 이용한 플립칩 공정", 대한금속·재료학회지, 50(10), pp.785~792 (2012), 대한금속·재료학회[DOI]
- K. J. Shin, "Micro-Power Generation Characteristics of Thermoelectric Thin Film Devices Processed by Electrodeposition and Flip-Chip Bonding", J. Electron. Mater, 44(6), pp.2026~ (2015)
- M. J. Yim, "Review of Electrically Conductive Adhesive Technologies for Electronic Packaging", Electron. Mater. Lett, 2(3), pp.183~ (2006)
- M. A. Uddin, "Contact Resistance of Anisotropic Conductive Adhesive Film Based Flip-chip on Glass Packages", Rev. Adv. Mater. Sci, 27(2), pp.151~ (2011)
- C. Brun, "Flip Chip Based on Carbon Nanotube-Carbon Nanotube Interconnected Bumps for High-Frequency Applications", IEEE Trans. Nanotechnol, 12, pp.609~ (2013)
- C. C. Yap, "Carbon Nanotube Bumps for the Flip Chip Packaging System", Nanoscale Res. Lett, 7, pp.105~ (2012)
- L. Aryasomayajula, "Carbon Nanotube Composites for Electronic Packaging Applications: A Review", J. Nanotechnol, 2013, pp.296517~ (2013)