웨팅밸런스법을 통한 젖음성 평가와 솔더의 젖음 특성
Wettability Evaluation by Wetting Balance Test and Wetting Characteristics of Solders
0
조회
0
다운로드
1
인용
0
참고문헌
키워드
초록
Wettability is an important factor to decide solderability of solder, flux, other soldering-related materials and soldering conditions. The wettability also affects the reliability of solder joint. Wetting balance test is a good method for quantitatively measuring wettability between solder and substrate. The wetting balance test is easy to reproduce the wetting experiment and to measure the wetting time and force. And this test provides wetting curve to calculate the surface tension of the molten solder. Development of new solder has been continued in accordance with various and harsh environment in the electronics industry. In this paper, the principle of wetting balance test and recent research issues including nanocomposite solder are explained. Keywords: wetting balance test,
Abstract
Wettability is an important factor to decide solderability of solder, flux, other soldering-related materials and soldering conditions. The wettability also affects the reliability of solder joint. Wetting balance test is a good method for quantitatively measuring wettability between solder and substrate. The wetting balance test is easy to reproduce the wetting experiment and to measure the wetting time and force. And this test provides wetting curve to calculate the surface tension of the molten solder. Development of new solder has been continued in accordance with various and harsh environment in the electronics industry. In this paper, the principle of wetting balance test and recent research issues including nanocomposite solder are explained. Keywords: wetting balance test,
참고문헌 (26)
- J. Y. Park, "Study on the analysis of wetting forces in the wetting balance curve and application to the prediction of solder joint geometry", Ph.D., pp.2000
- M. F. Arenas, "Contact angle measurements of Sn-Ag and Sn-Cu lead-free solders on copper substrates", J. Electron. Mater, 33(12), pp.1452~ (2004)
- S. M. Hong, "Fluxless wetting properties of UBM-coated Si-wafer to Sn-3. 5wt%Ag solder", IEEE Trans. Compon. Packag. Technol, 26(1), pp.255~ (2003)
- D. H. Jung, "Review of the wettability of solder with a wetting balance test for recent advanced microelectronic pacakaging", Crit. Rev. Solid State Mater. Sci, 44(4), pp.324~ (2018)
- L. G. Earle, "A quantitative study of soft soldering by means of the Kollagraph", J. I. Met., 6(1), pp.1~45 (1945)
- J. Y. Park, "The analysis of the withdrawal force curve of the wetting curve using 63Sn-37Pb and 96.5Sn-3.5Ag eutectic solders", J. Electron. Mater, 28(11), pp.1256~ (1999)
- J. L. Jellison, "Statistical interpretation of meniscograph solderability tests", IEEE Transactions on Parts, Hybrids, and Packaging, 12(2), pp.126~ (1976)
- C. Lea, "Quantitative solderability measurement of electronic components Part 2 : An Index of solderability", Solder. Surf. Mount Tech, 2(1), pp.14~ (1990)
- A. Mayhew, "Solderability by Meniscometry", Proc. Internepcon, 53 (1972)
- I. Artaki, "Evaluation of lead-free solder joints in electronic assemblies", J. Electron. Mater, 23(8), pp.757~ (1994)
- W. Gasior, "(Sn-Ag)eut + Cu soldering materials, Part I: Wettability studies", J. Phase Equilib. Diff, 25(2), pp.115~ (2003)
- J. I. Lee, "Reactive wetting between molten Sn-Bi and Ni substrate", J. Electron. Mater, 32(3), pp.117~ (2003)
- "Solder wettability test"[URL]
- K. M. Martorano, "Optimal conditions for the wetting balance test", J. Mater. Process. Tech, 209(6), pp.3091~ (2009)
- C. B. Lee, "The effect of Bi concentration on wettability of Cu substrate by Sn-Bi solders", Mater. Trans, 42(5), pp.751~ (2001)
- X. Zhao, "Effect of γ-Fe2O3 nanoparticles size on the properties of Sn-1.0Ag-0.5Cu nano-composite solders and joints", J. Alloy. Compd, 662, pp.272~ (2016)
- Y. Li, "Effect of TiO2 addition concentration on the wettability and intermetallic compounds growth of Sn-3.0Ag-0.5Cu-xTiO2 nanocomposite solders", Journal of Materials Science : Materials in Electronics, 25(9), pp.3816~ (2014)
- A. Sharma, "Effect of graphene nanoplatelets on wetting, microstructure, and tensile characteristics of Sn-3.0Ag-0.5Cu (SAC) alloy", Metall. Mater. Trans. A, 47(1), pp.494~ (2016)
- D. H. Jung, "Effects of AlN nanoparticles on the microstructure, solderability, and mechanical properties of Sn-Ag-Cu solder", Metall. Mater. Trans. A, 48(9), pp.4372~ (2017)
- Y. Gu, "Effects of Cobalt nanoparticles addition on shear strength, wettability and interfacial intermetallic growth of Sn-3.0Ag-0.5Cu solder during thermal cycling", Materials Science Forum, 815, pp.97~ (2015)
- X. Jiachen, "Effect of Ga on the inoxidizability and wettability of Sn-0.5Ag-0.7Cu-0.05Pr solder", Adv. Mater. Sci. Eng., 1 (2017)
- S. M. Hong, "A study on the wetting properties of UBM-coated Si-wafer", J. Microelectron. Packag. Soc, 7(2), pp.55~ (2000)
- 이순재, "자동차 전장용 무연 솔더 기술", 마이크로전자 및 패키징학회지, 22(3), pp.1~7 (2015), 한국마이크로전자및패키징학회