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나노박막 전사 방법 및 계면 파괴 역학

Nanofilm Transfer Methods and Interfacial Fracture Mechanics

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초록

기능성 나노박막을 손상 없이 목표기판으로 옮기는 전사 기술은 나노박막 기반의 차세대 응용 제품 개발을 위한 초석이다. 본 논문에서는 최근 나노박막 전사의 연구 동향을 박막–기판 계면의 박리 원리에 따라 습식 식각 전사, 전기화학적 박리, 기계식 전사 방법 세 가지로 분류하여 간단하게 살펴볼 것이다. 더 나아가, 손쉽고, 기판 재활용이 가능하며, 광범위한 적용 가능성을 가지고 있어 유망 기술로 간주되는 기계식 전사 방법에 대하여 파괴 역학적 관점에 초점을맞추어 다룰 것이다. 마지막으로, 나노박막의 기계식 전사 방법의 기술 성숙도를 향상시키기 위한 향후 도전 과제와 방향성에 대하여 고찰하고자 한다.

Abstract

Transferring of functional nanofilms onto target substrates is a cornerstone to developing nanofilm-based nextgeneration applications. In this work, we provide a brief review of recent advances on nanofilm transfer methods by categorizing them into the following three methods: wet-etching transfer, electrochemical delamination, and mechanical transfer. Furthermore, the mechanical transfer method, which is regarded as a promising technology owing to its facile, substrate recyclable, and widely applicable process, is overviewed by focusing on fracture mechanics approaches. Finally, the perspectives and challenges for future development of the mechanical transfer method are discussed.

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