위치제어가 없는 복수개의 마이크로솔더볼의 형상검사
A Shape Inspection of Multiple Micro Solder Balls without Positioning Control
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초록
초록 본 논문은 경면반사특성을 갖는 마이크로솔더볼의 품질확보를 위한 3차원형상의 결함검사 수단으로서, 정밀한 위치제어장치없이 유리접시에 임의로 놓여있는 마이크로솔더볼의 반사영상을 취득하고 이를 통계적으로 분석하여 3차원 형상의 결함유무를 검사하는 방법을 제안한다. 또한, 마이크로솔더볼에 인위적인 진동을 인가하여 위치와 방향을 바꾸면서 촬영과 검사를 반복하여 결함을 검출하는 방법을 제시하여, 마이크로솔더볼의 일부분만이 보이는 촬영영상의 한계를 극복하였다. 이를 위해 복수개의 LED를 링형태로 배열한 광원을 사용하고, 유리접시에 위치한 많은 수의 마이크로솔더볼을 동시에 촬영한 영상을 취득하고, 영상처리를 통해 반사되는 LED의 상대적 위치를 구한 후, 통계적 분석을 통하여 결함의 유무를 판단하는 방법을 제안하고 실험을 통해 그 효용성을 보인다.
Abstract
A statistical approach to inspection of the 3-D shape of micro solder balls is proposed, where an optical method with spatially arranged LED and specular reflection is used. The reflected image captured by a vision system was analyzed to calculate the relative displacements of LED’s in the image. Also, the statistics of displacements for the micro solder balls contained in a captured image are used to detect existing defects, and the usefulness of the proposed method is shown via experiments.
참고문헌 (14)
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