정전척 히터 패턴 설계를 위한 인자 별 온도 균일도 영향
Effect on Temperature Uniformity by Factor for the Design of Heater Pattern of Electrostatic Chuck
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초록
반도체 제조 공정에서 웨이퍼에 가해지는 온도를 균일하게 하기 위해 반도체 장비인 정전척의 활용 및 연구가활발하게 이루어지고 있다. 본 연구에서는 정전척의 부품 중 heater pattern의 설계를 통하여 표면 온도 균일도를 개선한모델을 제안한다. 정전척은 Two zone heater pattern과 bonding layer, dielectric layer, plate, cooling path로 구성된다. 공정환경은 RIE를 가정하였으며, 전극 단자에 전압을 인가하여 heater pattern에 열이 발생한다. 유한요소해석을 통하여 heater pattern의 선폭과 Pigtail을 변경한 모델에서 온도 균일도에 미치는 영향을 분석하였고, 패턴의 형상에 따른 전류 밀도의변화를 파악하였다. 최종적으로 제안된 설계 모델은 정전척 표면의 온도 균일도를 개선하여 반도체 공정의 일관성을 높이는 데 기여할 수 있을 것으로 보인다. 본 연구는 정전척의 설계 최적화를 위한 중요한 기초 자료가 될 것으로 기대된다.
Abstract
The use and research of electrostatic chuck, a semiconductor equipment, are actively conducted to equalize the temperature applied to the wafer in the semiconductor manufacturing process. In this study, we propose a model that optimize the surface temperature uniformity through the design of a heater pattern among the parts of the electrostatic chuck. Electrostatic chuck consist of the two zone heater pattern, bonding layer, dielectric layer, plate and cooling path. The process environment assumed RIE and the heater pattern was heated by the applied voltage. According to the finite element method, we analyzed the effect that influence to temperature uniformity about model changed line width and Pigtail of heater pattern, and figured out the change of current density by shape of pattern. Finally, the proposed design model is expected to significantly improve the temperature uniformity of the electrostatic chuck surface and contribute to increasing the consistency of the semiconductor process. This study is expected important basic data for design optimization of ESC.
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