Driving Forces of Silver Nano-porous Sheet Die Bonding at 145 °C and 175 °C in the Air
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This study reveals the feasibility and effectiveness of sinter bonding using an Ag nano-porous sheet at the lowest “theoretically” possible temperature of 145 °C. By uniform pressure of 10 MPa for bonding times of 5 min and 10 min at 145 and 175 °C, we achieved bonding strengths exceeding approximately 20 MPa with a only 5 min of bonding time at 145 °C. In particular, it is interesting to note that in the pressure sintering bonding process at 145 °C, bonding times of 5 and 10 min had no significant difference in strength. Even with a bonding temperature of 175 °C, the difference in average bonding strength between bonding times of 5 min (i.e., 37.6 MPa) and 10 min (i.e., 43.0 MPa) was only 5 MPa. The bonding strength was fundamentally attributed to the thickness of the Ag sintered neck in the Ag sintered layer. Microstructural analysis revealed that as the bonding temperature increased to 175 °C, the fraction of CSL Σ3 boundaries within the Ag sintered layer increased, indicating greater coalescence of Ag particles. This study systematically investigated the mechanism of bonding strength in extremely low-temperature pressure Ag sinter bonding, considering the relationship between microstructures and mechanical behaviors.
Abstract
This study reveals the feasibility and effectiveness of sinter bonding using an Ag nano-porous sheet at the lowest “theoretically” possible temperature of 145 °C. By uniform pressure of 10 MPa for bonding times of 5 min and 10 min at 145 and 175 °C, we achieved bonding strengths exceeding approximately 20 MPa with a only 5 min of bonding time at 145 °C. In particular, it is interesting to note that in the pressure sintering bonding process at 145 °C, bonding times of 5 and 10 min had no significant difference in strength. Even with a bonding temperature of 175 °C, the difference in average bonding strength between bonding times of 5 min (i.e., 37.6 MPa) and 10 min (i.e., 43.0 MPa) was only 5 MPa. The bonding strength was fundamentally attributed to the thickness of the Ag sintered neck in the Ag sintered layer. Microstructural analysis revealed that as the bonding temperature increased to 175 °C, the fraction of CSL Σ3 boundaries within the Ag sintered layer increased, indicating greater coalescence of Ag particles. This study systematically investigated the mechanism of bonding strength in extremely low-temperature pressure Ag sinter bonding, considering the relationship between microstructures and mechanical behaviors.
참고문헌 (24)
- D. Mehlig, "Accelerating electric vehicle uptake favours greenhouse gas over air pollutant emissions", Transp. Res. Part D Transp. Environ, 124, pp.103954~ (2023)
- L. F. S. Alves, "SIC power devices in power electronics : An overview", 14th Brazilian Power Electron. Conf. COBEP 2017, pp.1~8 (2017)
- M. Kanechika, "Advanced SiC and GaN power electronics for automotive systems", Tech. Dig. - Int. Electron Devices Meet. IEDM, pp.13.5.1~13.5.4 (2010)
- C. Buttay, "State of the art of high temperature power electronics", Materials Science and Engineering B : Solid-State Materials for Advanced Technology, 176(4), pp.283~288 (2011)
- A. Khaligh, "Global Trends in High-Power On-Board Chargers for Electric Vehicles", IEEE Trans. Veh. Technol, 68(4), pp.3306~3324 (2019)
- A. Khaligh, "Comprehensive topological analysis of conductive and inductive charging solutions for plugin electric vehicles", IEEE Trans. Veh. Technol, 61(8), pp.3475~3489 (2012)
- D. Kim, "Advances in Power Semiconductor Devices for Automotive Power Inverters : SiC and GaN", Packag. Soc, 30(2), pp.43~51 (2023)
- J. -H. Lee, "High Technology and Latest Trends of WBG Power Semiconductors", Packag. Soc, 25(4), pp.17~23 (2018)
- J. Biela, "SiC versus Si-Evaluation of potentials for performance improvement of inverter and DCDC converter systems by SiC power semiconductors", IEEE Trans. Ind. Electron, 58(7), pp.2872~2882 (2011)
- C. Chen, "High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates", J. Mater. Sci. Mater. Electron, 29(3), pp.1785~1797 (2018)
- J. Li, "Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles", J. Mater. Process. Technol, 215(1), pp.299~308 (2015)
- J. Fan, "Experimental Investigation on the Sintering Kinetics of Nanosilver Particles Used in High-Power Electronic Packaging", Trans. Components, Packag. Manuf. Technol, 10(7), pp.1101~1109 (2020)
- Y. Zhao, "Evaluation of Ag sintering die attach for high temperature power module applications", Proc. Electron. Packag. Technol. Conf. EPTC, pp.200~204 (2014)
- D. Kim, "Macroscale and microscale structural mechanisms capable of delaying the fracture of low-temperature and rapid pressureless Ag sintered electronics packaging", Mater. Charact, 198, pp.112758~ (2023)
- M. -S. Kim, "Ag Sintering Die Attach Technology for Wide-bandgap Power Semiconductor Packaging", Packag. Soc, 30(1), pp.1~16 (2023)
- S. K. Lin, "Nano-volcanic eruption of silver", Sci. Rep, 6, pp.34769~ (2016)
- J. Liu, "Coalescence behavior of Cu nanoparticles during sintering : Based on atomic scale to macro scale", J. Mater. Res. Technol, 27, pp.2490~2507 (2023)
- M. R. Mazlan, "Necking mechanism under various sintering process parameters – A review", J. Mater. Res. Technol, 23, pp.2189~2201 (2023)
- W. C. Mallard, "Self-Diffusion in Silver-Gold Solid Solutions", Phys. Rev, 129(2), pp.617~ (1963)
- B. Hallstedt, "Thermodynamic assessment of the Silicon-Oxygen system", Calphad, 16(1), pp.53~61 (1992)
- S. Tsurekawa, "Improvement of oxidation resistance and oxidation-induced embrittlement by controlling grain boundary microstructure in silicon carbides with different dopants", Mater. Trans, 45(7), pp.2128~2136 (2004)
- M. Chiodi, "Massive Ag migration through metal", ceramic nano-multilayers : An interplay between temperature, stress-relaxation and oxygen-enhanced mass transport, 2016, pp.4(22), 4927~4938
- T. Ogura, "Bondability of copper joints formed using a mixed paste of Ag2O and CuO for low-temperature sinter bonding", Mater. Trans, 54(6), pp.860~865 (2013)
- G. Hasson, "Theoretical and experimental determinations of grain boundary structures and energies: Correlation with various experimental results", Surf. Sci, 31(C), pp.115~137 (1972)