전기화학 공정을 이용한 질화규소 기판 상의금속 전극 형성에 관한 연구
Formation of Metal Electrode on Si3N4 Substrate by Electrochemical Technique
1
조회
0
다운로드
0
인용
0
참고문헌
키워드
초록
There is a close relationship between the performance and the heat generation of the electronic device. Heat generation causes a significant degradation of the durability and/or efficiency of the device. It is necessary to have an effective method to release the generated heat. Based on demands of the printed circuit board (PCB) manufacturing, it is necessary to develop a robust and reliable plating technique for substrates with high thermal conductivity, such as alumina (Al2O3), aluminium nitride (AlN), and silicon nitride (Si3N4). In this study, the plating of metal layers on an insulating silicon nitride (Si3N4) ceramic substrate was developed. We formed a Pd-TiO2 adhesion layer and used APTES(3-Aminopropyltriethoxysilane) to form OH groups on the surface and adhere the metal layer on the insulating Si3N4 substrate. We used an electroless Ni plating without sensitization/activation process, as Pd particles were nucleated on the TiO2 layer. The electrical resistivity of Ni and Cu layers is 7.27 × 10−5 and 1.32 × 10−6 ohm-cm by 4 point prober, respectively. The adhesion strength is 2.506 N by scratch test.
Abstract
There is a close relationship between the performance and the heat generation of the electronic device. Heat generation causes a significant degradation of the durability and/or efficiency of the device. It is necessary to have an effective method to release the generated heat. Based on demands of the printed circuit board (PCB) manufacturing, it is necessary to develop a robust and reliable plating technique for substrates with high thermal conductivity, such as alumina (Al2O3), aluminium nitride (AlN), and silicon nitride (Si3N4). In this study, the plating of metal layers on an insulating silicon nitride (Si3N4) ceramic substrate was developed. We formed a Pd-TiO2 adhesion layer and used APTES(3-Aminopropyltriethoxysilane) to form OH groups on the surface and adhere the metal layer on the insulating Si3N4 substrate. We used an electroless Ni plating without sensitization/activation process, as Pd particles were nucleated on the TiO2 layer. The electrical resistivity of Ni and Cu layers is 7.27 × 10−5 and 1.32 × 10−6 ohm-cm by 4 point prober, respectively. The adhesion strength is 2.506 N by scratch test.
참고문헌 (19)
- W. Devin, "Method of Forming Conductive Traces on Insulated Substrate", ~ (2014)
- Y. J. Heo, "Enhanced heat transfer by room temperature deposition of AlN film on aluminum for a light emitting diode package", Appl. Therm. Eng, 50, pp.799~804 (2013)
- A. Miller, "Electrochemical copper metallization of glass substrates mediated by solution-phase deposition of adhesion-promoting layers", J. Electrochem. Soc, 162, pp.D630~D634 (2015)
- P. Walker, "Silane and other adhesion promoters in adhesive technology", Handbook of Adhesive Technology, 2, pp.205~221 (2003)
- J. Kudr, "Fabrication of solid-state nanopores and its perspectives", Electrophoresis, 36, pp.2367~2379 (2015)
- J. Sittikun, "Pd", TiO2 catalysts prepared by electroless deposition with and without SnCl2 sensitization for the liquidphase hydrogenation of 3-hexyn-1-ol, Reaction Kinetics, 2014, pp.111, 123~135
- Y. K. Cho, "A study on adhesion strength of electroless plated deposits on Alumina substrate", J. Kor. Inst. Surf. Eng, 24, pp.187~195 (1991)
- N. Abe, "Influence of a TiO2 adhesion layer on the structure and the orientation of a pt layer in Pt", TiO2, Si structures, pp.Jpn. J. Appl. Phys, 2003[DOI]
- K. Davis, "Quantitative infrared spectroscopic measurement of hydroxyl concentrations in silica glass", J. Non Cryst. Solids, 203, pp.27~36 (1996)
- G. Matrajt, "FTIR and raman analyses of the tagish lake meteorite:Relationship with the aliphatic hydrocarbons observed in the diffuse interstellar medium", Astronomy & Astrophysics, 416, pp.983~990 (2004)
- U. Kirchner, "FTIR spectroscopic investigation of the mechanism and kinetics of the heterogeneous reactions of NO2and HNO3 with soot", J. Phys. Chem. A, 104, pp.8908~8915 (2000)
- S. L. Brandow, "The morphology of electroless ni deposition on a colloidal pd (II)catalyst", J. Electrochem. Soc, 142, pp.2233~2243 (1995)
- M. Honkanen, "Characterization of silane layers on modified stainless steel surfaces and related stainless steel–plastic hybrids", Appl. Surf. Sci, 257, pp.9335~9346 (2011)
- M. Bechelany, "Large-scale preparation of faceted Si3N4 nanorods from β-SiC nanowires", J. Nanotech, 18, pp.335305~ (2007)
- K. H. Leong, "Palladium nanoparticles anchored to anatase TiO2 for enhanced surface plasmon resonancestimulated, visible-light-driven photocatalytic activity", Beilstein J. Nanotech, 6, pp.428~437 (2015)
- A. Hamada, "Indentation property and corrosion resistance of electroless nickel–phosphorus coatings deposited on austenitic high-mn TWIP steel", Appl. Surf. Sci, 356, pp.1~8 (2015)
- A. Rittermeier, "The formation of colloidal copper nanoparticles stabilized by zinc stearate: One-pot single-step synthesis and characterization of the core–shell particles", Phys. Chem. Chem. Phys, 11, pp.8358~8366 (2009)
- "A. Standard, D3359-09e2. standard test methods for measuring adhesion by tape test", ASTM International, ~ (2009)
- W. Heinke, "Evaluation of PVD nitride coatings, using impact, scratch and rockwell-C adhesion tests", Thin Solid Films, 270, pp.431~438 (1995)