저융점 합금(Bi58Sn42)을 이용한 Metal Mesh Touch Sensor용 Ag 페이스트의 전기적 특성
Electrical Characteristics of the Ag Past with addition of Low-melting Alloy of Bi58Sn42 for Metal Mesh Touch Sensors
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In this study, a transient liquid phase sintering (TLPS) process of Ag pastes mixed with a fusible metal alloy of Bi58Sn42 with the melting temperature of 138oC, was examined. After screen printing of the Ag pastes with and without Bi58Sn42 powders on polyimide (PI) substrates, the electrodes were heat-treated at different temperatures in the range between 150 and 300oC for 60 min in air. Comparing the electrical conductivity of the Ag pastes with and without Bi58Sn42 alloy powder after the heat treatment, it was manifested that the low melting temperature alloy definitely played a major role in an increased conductivity when it is added into the Ag pastes by providing more electrical conduction paths between Ag particles. This can be explained by the fact that capillary force of the melts of Bi58Sn42 can contribute to the rearrangement of the Ag particles during the heat-treatment inducing better connectivity between the Ag particles.
Abstract
In this study, a transient liquid phase sintering (TLPS) process of Ag pastes mixed with a fusible metal alloy of Bi58Sn42 with the melting temperature of 138oC, was examined. After screen printing of the Ag pastes with and without Bi58Sn42 powders on polyimide (PI) substrates, the electrodes were heat-treated at different temperatures in the range between 150 and 300oC for 60 min in air. Comparing the electrical conductivity of the Ag pastes with and without Bi58Sn42 alloy powder after the heat treatment, it was manifested that the low melting temperature alloy definitely played a major role in an increased conductivity when it is added into the Ag pastes by providing more electrical conduction paths between Ag particles. This can be explained by the fact that capillary force of the melts of Bi58Sn42 can contribute to the rearrangement of the Ag particles during the heat-treatment inducing better connectivity between the Ag particles.
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