Deposition of Super Hydrophobic a-C:F films by dielectric barrier discharge at Atmospheric Pressure
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Hydrophobic a-C:F film was coated on polycarbonate film with CF_4, C_2F_6 and HFC (C_2F_4H_2) gas in helium discharge generated by 5~100 kHz AC power supply at atmospheric pressure and room temperature. The highest water contact angle of the a-C:F film formed with He/C_2F_6 mixed gas is 155˚. X-ray photoelectron spectrum showed that there was 40% of C-CF_3 bond at the surface of the super hydrophobic film. The contact angle and deposition rate were decreased with increasing substrate temperature. The contact angle was generally increased with the surface roughness of the film. The contact angle was high when the surface microstructure of the film was fine and sharp at the similar roughness and chemical composition of the surface.
Abstract
Hydrophobic a-C:F film was coated on polycarbonate film with CF_4, C_2F_6 and HFC (C_2F_4H_2) gas in helium discharge generated by 5~100 kHz AC power supply at atmospheric pressure and room temperature. The highest water contact angle of the a-C:F film formed with He/C_2F_6 mixed gas is 155˚. X-ray photoelectron spectrum showed that there was 40% of C-CF_3 bond at the surface of the super hydrophobic film. The contact angle and deposition rate were decreased with increasing substrate temperature. The contact angle was generally increased with the surface roughness of the film. The contact angle was high when the surface microstructure of the film was fine and sharp at the similar roughness and chemical composition of the surface.
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