첨가제에 의한 경질 크롬 도금 층의 열처리 후기계적 특성 향상에 관한 연구
Study on Improvement of Mechanical Properties after Heat Treatment of Hard Chromium Electrodeposits with Additives
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The addition of cyclo propane carbonyl (cpc) to chromium electroplating bath resulted in a chromium depositwhich had greatly improved mechanical properties compared to conventional chromium deposits in conditionof heat treatment at high temperature. The as?deposited layers had a Vicker's hardness of about 1170, whichis comparable to that of conventional chromium plating deposits. With annealing, the hardness goes througha maximum of 1650 at 600°C. Generally speaking, the hardness of conventional plating decreases monotonicallywith heat treatment. X?ray diffraction show that annealing up to above 400°C causes formationand growth of chromium crystallites and that chromium carbides form at above 500°C temperature.
Abstract
The addition of cyclo propane carbonyl (cpc) to chromium electroplating bath resulted in a chromium depositwhich had greatly improved mechanical properties compared to conventional chromium deposits in conditionof heat treatment at high temperature. The as?deposited layers had a Vicker's hardness of about 1170, whichis comparable to that of conventional chromium plating deposits. With annealing, the hardness goes througha maximum of 1650 at 600°C. Generally speaking, the hardness of conventional plating decreases monotonicallywith heat treatment. X?ray diffraction show that annealing up to above 400°C causes formationand growth of chromium crystallites and that chromium carbides form at above 500°C temperature.
참고문헌 (15)
- K. A. Laboda, , J. Electrochem. Soc, 127, pp.1709~ (1980)
- A. Szasz, , Thin Solid Films, 116, pp.279~ (1984)
- R. Brill, , Z. f. Krist, 75, pp.217~ (1930)
- A. Brenner, , J. Res. Nat'l. Bur. Stand, 44, pp.109~ (1950)
- A. W. Goldstein, , J. Electrochem. Soc, 44, pp.104~ (1957)
- T. Watanabe, , J. Met. Fin. Soc. Jpn, 38, pp.210~ (1987)
- R. C. Ruhl, , Mater. Sci. Eng, 1, pp.313~ (1967)
- I. Ohnake, , J. Jpn. Inst. Met, 45, pp.751~ (1981)
- Y. Shimada, , IEEE Trans, 17, pp.1199~ (1981)
- K. Niihara, , J. Mater. Sci, 11, pp.596~ (1976)
- H. Maeda, , J. Phys. Soc. Jpn, 29, pp.570~ (1970)
- S. Hoshino, , J. Electrochem. Soc, 133, pp.681~ (1986)
- J. C. Crowther, , Electroplating and Metal Finishing, 28, pp.6~ (1975)
- E. Muller, , Z. Electrochen, 50, pp.172~ (1994)
- F. Ogbun, , J. Electrochem. Soc, 96, pp.347~ (1949)