선택적 전기화학 3D 프린터 기술 소개 및 PCB 양산공정 적용방식 고찰
Introduction of Selective Electrochemical Additive Manufacturing Technology and Consideration of Integration Method for PCB Mass Production Process
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초록
Some studies on electrochemical additive manufacturing of metals were summarized in this technical report, and development status of selective electrochemical 3D printing technology was introduced. In order to apply it to the PCB mass production process, essential considerations how to overcome the fundamental problems, such as the sizing, process sequence and PCB process design have been described.
Abstract
Some studies on electrochemical additive manufacturing of metals were summarized in this technical report, and development status of selective electrochemical 3D printing technology was introduced. In order to apply it to the PCB mass production process, essential considerations how to overcome the fundamental problems, such as the sizing, process sequence and PCB process design have been described.
참고문헌 (8)
- 김성빈, "전기화학 및 노즐 유체역학 방식의 3D 프린터 개발을 통한 금속 적층공정 특성 분석과초미세 인쇄전자회로 제작", 대한금속재료학회, 3D 프린팅 심포지엄 (2021)
- Jie Hu, "Meniscus-confined three-dimensional electrodeposition for direct writing of wire bonds", Science, 329, pp.313~ (2010)
- SK Seol, "Electrodeposition-based 3D printing of metallic microarchitectures with controlled internal structures", Small, 11, pp.3896~ (2015)
- A Kamaraj, "Numerical study of localized electrochemical deposition for micro electrochemical additive manufacturing", ScienceDirect, 42, pp.788~ (2016)
- YG Kim, "The characteristics of selective 3D metal additive process using electrochemical deposition and nozzle fluid dynamics", Frontiers in Mechanical Engineering, 6, pp.1~ (2020)
- 김영국, "전기화학적 금속 3D 프린터의 적층 조건 연구를 통한 마이크로 코일 제작", 한국표면공학회지, 53(4), pp.138~143 (2020), 한국표면공학회[DOI]
- 박찬규, "선택적 금속 전착에 대한 전해질 온도 및 전류밀도 영향분석", 한국표면공학회지, 51(6), pp.400~404 (2018), 한국표면공학회[DOI]
- 홍순관, "새로운 PCB 제조기술 입문" (2017), 복두출판사