논시안 금도금층의 조직과 경도에 미치는 Tl+ 과 Pd2+ 이온첨가의 영향
Effect of addition of Tl+ and Pd2+ on the texture and hardness of the non-cyanide gold plating layer
0
조회
0
다운로드
1
인용
0
참고문헌
키워드
초록
Due to its high electrical conductivity, low contact resistance, good weldability and high corrosion resi-stance, gold is widely used in electronic components such as connectors and printed circuit boards (PCB). Gold ion salts currently used in gold plating are largely cyan-based salts and non-cyanic salts. The cya-nide bath can be used for both high and low hardness, but the non-cyanide bath can be used for low hardness plating. Potassium gold cyanide (KAu(CN)₂) as a cyanide type and sodium gold sulfite (Na₃[Au(SO)₃]₂) salt as a non-cyanide type are most widely used. Although the cyan bath has excellent performance in plating, potassium gold cyanide (KAu(CN)₂) used in the cyan bath is classified as a poison and a toxic substance and has strong toxicity, which tends to damage the positive photoresist film and make it difficult to form a straight side-wall. There is a need to supplement this. Therefore, it is intended to supplement this with an eco-friendly process using sodium sulfite sodium salt that does not contain cyan. Therefore, the main goal is to form a gold plating layer with a controllable hardness using a non-cyanide gold plating solution. In this study, the composition of a non-cyanide gold plating solution that maintains hardness even after annealing is generated through gold-palladium alloying by adding thallium, a crystal regulator among electrolysis factors affecting the structure and hardness, and changes in plating layer structure and crystallinity before and after annealing the correlation with the hardness.
Abstract
Due to its high electrical conductivity, low contact resistance, good weldability and high corrosion resi-stance, gold is widely used in electronic components such as connectors and printed circuit boards (PCB). Gold ion salts currently used in gold plating are largely cyan-based salts and non-cyanic salts. The cya-nide bath can be used for both high and low hardness, but the non-cyanide bath can be used for low hardness plating. Potassium gold cyanide (KAu(CN)₂) as a cyanide type and sodium gold sulfite (Na₃[Au(SO)₃]₂) salt as a non-cyanide type are most widely used. Although the cyan bath has excellent performance in plating, potassium gold cyanide (KAu(CN)₂) used in the cyan bath is classified as a poison and a toxic substance and has strong toxicity, which tends to damage the positive photoresist film and make it difficult to form a straight side-wall. There is a need to supplement this. Therefore, it is intended to supplement this with an eco-friendly process using sodium sulfite sodium salt that does not contain cyan. Therefore, the main goal is to form a gold plating layer with a controllable hardness using a non-cyanide gold plating solution. In this study, the composition of a non-cyanide gold plating solution that maintains hardness even after annealing is generated through gold-palladium alloying by adding thallium, a crystal regulator among electrolysis factors affecting the structure and hardness, and changes in plating layer structure and crystallinity before and after annealing the correlation with the hardness.
참고문헌 (26)
- T. Osaka, "Mechanism of sulfur inclusion in soft gold electrodeposited from the thiosulfate-sulfite bath", J. Electrochem. Soc, 148, pp.C659~ (2001)
- M. Schlesinger, "Modern electroplating" (2011), John Wiley &Sons
- F. H. Reid, "Gold plating technology" (1974), Electrochemical Publications Limited
- H. Watanabe, "Microbump formation by noncyanide gold electroplating", J. Electrochem. Soc., 146, pp.574~579 (1999)
- "Korean J. Master. Res", 1995, 673~681
- H. Honma, "Fabrication of gold bumps using gold sulfite plating", J. Electrochem. Soc., 142, pp.81~87 (1995)
- M. Hosseini, "The effect of Tl(I)on the hard gold alloy electrodeposition of Au-Co from acid baths", J. Electroanal. Chem, 645, pp.109~114 (2010)
- M. Saito, "Effect of Tl-codeposition on Au electrodeposition from non-cyanide bath", ECS Trans, 25, pp.87~96 (2010)
- T. Sehayek, "Au-Pd alloy gradients prepared by laterally controlled template synthesis", Adv. Funct. Mater, 16, pp.693~698 (2006)
- ionic liquid, "J. Electrochem. Soc", 2004, C811~
- S. Yasuo, "Electron microscopic investigation on the microstructure and phase of electrodeposited Au-Pd alloys", SFSJ, 27, pp.574~580 (1976)
- T. Yoshimi, "Formation and morophology of electrodeposited Au-Pd alloy films on Cu substrates", SFSJ, 26, pp.19~26 (1975)
- Y. Shunichi, "The effect of arsenic on the electrodeposition of palladium from ethylenediamin-palladium(Ⅱ) complex solutions", SFSJ, 36, pp.359~364 (1985)
- C. Shin, "The effect of thallium on palladium electrodeposition from ethylenediamine-palladium(Ⅱ) complex solutions", SFSJ, 39(3), pp.123~127 (1988)
- H. Okamoto, "The Au-Pd (gold-palladium) system", Bull. Alloy Phase Diagr, 6, pp.229~235 (1985)
- B. D. Cullity, "Elements of X-ray diffraction" (1956), Addison-Wesley Publishing
- H. Nakano, "Effect of electrolysis factors on crystal orientation and morphology of electrodeposited cobalt", J. Appl. Electrochem, 32, pp.43~48 (2002)
- R. M. Bozorth, "The orientations of crystals in electrodeposited metals", Phys. Rev, 26, pp.390~400 (1925)
- H. J. Lee, "Study on the electroplating process and crystallographic characteristics for copper interconnect", Doctor, pp.2003
- J. H. Cho, "Recrystallization and grain growth of cold-rolled gold sheet", Metall. Mater. Trans. A Phys. Metall. Mater. Sci., 36, pp.3415~3425 (2005)
- M. Hillert, "On the theory of normal and abnormal grain growth", Acta Metall, 13, pp.227~238 (1965)
- F. J. Humphreys, "Grain growth following recrystallization", Recryst. Relat. Annealing Phenom, pp.281~325 (1995)
- 이현우, "순도에 따른 Al 판재의 재결정 거동", 한국재료학회지, 26(12), pp.688~695 (2016), 한국재료학회
- J. H. Park, "Statistical analysis on static recrystallization texture evolution in cold-rolled AZ31 magnesium alloy sheet", Microsc. Microanal, 19, pp.21~24 (2013)
- B. Kebabi, "Stress and microstructure relationships in gold thin films", Vacuum, 41, pp.1353~1355 (1990)
- M. R. J. Wyllie, "The influence of internal stress on the structure of electro-deposits", J. Chem. Phys, 16, pp.52~64 (1948)