선형 Roll-CMP에서 공정변수에 관한 통계적 분석
Statistical Analysis on Process Variables in Linear Roll-CMP
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Nowadays, most micro-patterns are manufactured during flow line production. However, a conventionalrotary chemical mechanical polishing (CMP) system has a limited throughput for the fabrication oflarge and flexible electronics. To overcome this problem, we propose a novel linear roll-CMP system for the planarizationof large-area electronics. In this paper, we present a statistical analysis on the linear roll-CMP processof copper-clad laminate (CCL) to determine the impacts of process parameters on the material removal rate(MRR) and its non-uniformity (NU). In the linear roll-CMP process, process parameters such as the slurry flowrate, roll speed, table feed rate, and down force affect the MRR and NU. To determine the polishing characteristicsof roll-CMP, we use Taguchi’s orthogonal array L16 (44) for the experimental design and F-valuesobtained by the analysis of variance (ANOVA). We investigate the signal-to-noise (S/N) ratio to identify theprominent control parameters. The “higher is better” for the MRR and “lower is better” for the NU were selectedfor obtaining optimum CMP performance characteristics. The experimental and statistical results indicate that thedown force and roll speed mainly affect the MRR and the down force and table feed rate determine the NU inthe linear roll-CMP process. However, over 186.3 N of down force deteriorates the NU because of the bendingof substrate. Roll speed has little relationship to the NU and the table feed rate does not impact on the MRR. This study provides information on the design parameter of roll-CMP machine and process optimization.
Abstract
Nowadays, most micro-patterns are manufactured during flow line production. However, a conventionalrotary chemical mechanical polishing (CMP) system has a limited throughput for the fabrication oflarge and flexible electronics. To overcome this problem, we propose a novel linear roll-CMP system for the planarizationof large-area electronics. In this paper, we present a statistical analysis on the linear roll-CMP processof copper-clad laminate (CCL) to determine the impacts of process parameters on the material removal rate(MRR) and its non-uniformity (NU). In the linear roll-CMP process, process parameters such as the slurry flowrate, roll speed, table feed rate, and down force affect the MRR and NU. To determine the polishing characteristicsof roll-CMP, we use Taguchi’s orthogonal array L16 (44) for the experimental design and F-valuesobtained by the analysis of variance (ANOVA). We investigate the signal-to-noise (S/N) ratio to identify theprominent control parameters. The “higher is better” for the MRR and “lower is better” for the NU were selectedfor obtaining optimum CMP performance characteristics. The experimental and statistical results indicate that thedown force and roll speed mainly affect the MRR and the down force and table feed rate determine the NU inthe linear roll-CMP process. However, over 186.3 N of down force deteriorates the NU because of the bendingof substrate. Roll speed has little relationship to the NU and the table feed rate does not impact on the MRR. This study provides information on the design parameter of roll-CMP machine and process optimization.
참고문헌 (14)
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