직조된 SiC 섬유에 무전해 구리도금 시 도금 조건의 영향
Effect of Plating Conditions on Electroless Copper Plating on SiC Fabric
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Effects of plating conditions (dispersant concentration, plating time, and ultrasonication) on electroless Cu plating on SiC fabric woven by crossing of SiC continuous fibers vertically were studied. The ultrasonic dispersion treatment not only did not improve the dispersion of the SiC fibers, but also did not change the plating thickness. The ultrasonication in the pretreatment step of electroless plating did not improve the dispersion of the fibers, while the ultrasonication in the plating step enhanced the dispersion of the fibers and decreased the thickness of the Cu films. It was possible to control the thickness of the Cu coating layer as well as the dispersion of the fibers in the fabric by changing the plating conditions such as dispersant concentration, plating time, and ultrasonication, but it was very difficult to coat copper on the intersection of vertical fibers in the fabric.
Abstract
Effects of plating conditions (dispersant concentration, plating time, and ultrasonication) on electroless Cu plating on SiC fabric woven by crossing of SiC continuous fibers vertically were studied. The ultrasonic dispersion treatment not only did not improve the dispersion of the SiC fibers, but also did not change the plating thickness. The ultrasonication in the pretreatment step of electroless plating did not improve the dispersion of the fibers, while the ultrasonication in the plating step enhanced the dispersion of the fibers and decreased the thickness of the Cu films. It was possible to control the thickness of the Cu coating layer as well as the dispersion of the fibers in the fabric by changing the plating conditions such as dispersant concentration, plating time, and ultrasonication, but it was very difficult to coat copper on the intersection of vertical fibers in the fabric.
참고문헌 (17)
- A. M. Bayomy, "Electronic cooling using water flow in aluminum metal foam heat sink: Experimental and numerical approach", International Journal of Thermal Sciences, 109, pp.182~200 (2016)
- P. K. Schelling, "Managing heat for electronics", Mater Today, 8, pp.30~35 (2005)
- K. Mizuuchi, "Processing and thermal properties of Al", AlN composites in continuous solid-liquid co-existent state by spark plasma sintering, 2012, pp.43, 1557~1563
- M. Kida, "Thermal conductivity and interfacial conductance of AlN particle reinforced metal matrix composites", Journal of Applied Physics, 109, pp.064907~ (2011)
- K. Mizuuchi, "Processing of Al", SiC composites in continuous solid-liquid co-existent state by SPS and their thermal properties, 2012, pp.43, 2012~2019
- J. Molina, "Thermal conductivity of Al–SiC composites with monomodal and bimodal particle size distribution", Mater. Sci. Eng. A, 480, pp.483~488 (2008)
- B. G. Kim, "Effects of thermal processing on thermal expansion coefficient of a 50 vol.% SiCp", Al composite, 2001, pp.72, 42~47
- K. Pietrzak, "Effects of Carbon Allotropic Forms on Microstructure and Thermal Properties of Cu-C Composites Produced by SPS", J. Mater. Eng. Perform, 25, pp.3077~3083 (2016)
- E. Neubauer, "Potential and challenges of metal-matrixcomposites reinforced with carbon nanofibers and carbon nanotubes", Compos. Sci. Technol, 70, pp.2228~2236 (2010)
- P. Goli, "Thermal properties of graphenecopper-graphene heterogeneous films", Nano Lett, 14, pp.1497~1503 (2014)
- D. M. Jarzabek, "The effect of metal coatings on the interfacial bonding strength of ceramics to copper in sintered Cu-SiC composites", Ceramic International, 43, pp.5283~5291 (2017)
- M. Chmielewski, "Microstructure and thermal properties of Cu-SiC composite materials depending on the sintering technique", Science of Sintering, 49, pp.11~22 (2017)
- O. S. Fatoba, "The Effects of Silicon Carbide Reinforcement on the Properties of Cu", SiCp Composites, 2015, pp.7, 351~356
- P. Wang, "Effect of Ni-P alloy coating on microstructures and properties of vacuum brazed joints of SiCp", Al composites, 2017, pp.31, 1750082~
- Y. K. Jeong, "Synthesis and Consolidation of Nano-Sized Cu Coated SiC Powders by a Chemical Method and Spark Plasma Sintering", Journal of Nanoscience and Nanotechnology, 16, pp.1993~1995 (2016)
- S. Faraji, "An investigation on electroless Cu-P composite coatings with micro and nano-SiC particles", Materials & Design, 54, pp.570~575 (2014)
- 이기환, "무전해 Cu 도금층의 두께와 표면조도에 미치는 도금조건의 영향", 대한금속·재료학회지, 54(4), pp.237~245 (2016), 대한금속·재료학회[DOI]