삼차원 표면 조도 측정기와 삼차원 레이저 공초점 현미경 적용에 따른 표면 거칠기에 대한 영향 연구
Study of the Effect of Surface Roughness through the Application of 3D Profiler and 3D Laser Confocal Microscope
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초록
Surface topography plays a decisive role in determining the performance of several precision components. In particular, the surface roughness of semiconductor devices affects the precision of the circuit. In this regard, the surface topography of a given surface needs to be appropriately assessed. Typically, the average roughness is used as one of the main indicators of surface finish quality because it is influenced by both dynamic and static parameters. Owing to the increasing demand for such accurate and reliable surface measurement systems, studies are continuously being conducted to understand the parameters of surface roughness and measure the average roughness with high reliability. However, the differences in the measurement methods of surface roughness are not clearly understood. Hence, in this study, the surface roughness of the back of a silicon wafer was measured using both contact and noncontact methods. Subsequently, a comparative analysis was conducted according to various surface roughness parameters to identify the differences in surface roughness depending on the measurement method. When using a 3D laser confocal microscope, even smaller surface asperities can be measured compared with the use of a 3D profiler. The results are expected to improve the understanding of the surface roughness characteristics of precision components and be used as a useful guideline for selecting the measurement method for surface topography assessment.
Abstract
Surface topography plays a decisive role in determining the performance of several precision components. In particular, the surface roughness of semiconductor devices affects the precision of the circuit. In this regard, the surface topography of a given surface needs to be appropriately assessed. Typically, the average roughness is used as one of the main indicators of surface finish quality because it is influenced by both dynamic and static parameters. Owing to the increasing demand for such accurate and reliable surface measurement systems, studies are continuously being conducted to understand the parameters of surface roughness and measure the average roughness with high reliability. However, the differences in the measurement methods of surface roughness are not clearly understood. Hence, in this study, the surface roughness of the back of a silicon wafer was measured using both contact and noncontact methods. Subsequently, a comparative analysis was conducted according to various surface roughness parameters to identify the differences in surface roughness depending on the measurement method. When using a 3D laser confocal microscope, even smaller surface asperities can be measured compared with the use of a 3D profiler. The results are expected to improve the understanding of the surface roughness characteristics of precision components and be used as a useful guideline for selecting the measurement method for surface topography assessment.
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