The removal of saw marks on diamond wire-sawn single crystalline silicon wafers
1
조회
0
다운로드
0
인용
0
참고문헌
키워드
초록
The diamond wire sawing method to produce silicon wafers for the photovoltaic application is still a new and highly investigated wafering technology. This technology, featured as the higher productivity, lower wear of the wire, and easier recycling of the coolant, is expected to become the mainstream technique for slicing the silicon crystals. However, the saw marks on the wafer surface have to be investigated and improved. This paper discusses the removal of saw marks on diamond wire-sawn single crystalline silicon wafer. With a pretreatment step using tetramethyl ammonium hydroxide ((CH3)4NOH, TMAH) and conventional texturing process with KOH solution (1 % KOH, 8 % IPA, and DI water), the saw marks on the surface of the diamond wire-sawn silicon wafers can be effectively removed and they are invisible to naked eyes completely.
Abstract
The diamond wire sawing method to produce silicon wafers for the photovoltaic application is still a new and highly investigated wafering technology. This technology, featured as the higher productivity, lower wear of the wire, and easier recycling of the coolant, is expected to become the mainstream technique for slicing the silicon crystals. However, the saw marks on the wafer surface have to be investigated and improved. This paper discusses the removal of saw marks on diamond wire-sawn single crystalline silicon wafer. With a pretreatment step using tetramethyl ammonium hydroxide ((CH3)4NOH, TMAH) and conventional texturing process with KOH solution (1 % KOH, 8 % IPA, and DI water), the saw marks on the surface of the diamond wire-sawn silicon wafers can be effectively removed and they are invisible to naked eyes completely.
참고문헌 (8)
- H. Wu, "Wire sawing technology : A state-of-the-art review", Precision Eng, 43, pp.1~ (2016)
- 이경희, "다이아몬드 코팅 와이어로 가공된 태양전지용 실리콘 웨이퍼의 표면 특성에 관 한 연구", 한국결정성장학회지, 21(6), pp.225~229 (2011), 한국결정성장학회
- 이경희, "Quality evaluation of diamond wire-sawn gallium-doped silicon wafers", 한국결정성장학회지, 23(3), pp.119~123 (2013), 한국결정성장학회[DOI]
- W. Li, "Automatic saw-mark detection in multicrystalline solar wafer images", Sol. Energy Mater. Sol. Cells, 95, pp.2206~ (2011)
- M. Lippold, "Texturing of SiC-slurry and diamond wire sawn silicon wafers by HF-HNO3-H2SO4mixtures", Sol. Energy Mater. Sol. Cells, 127, pp.104~ (2014)
- H. Takato, "Method for fabricating substrate for solar cell and solar cell", US Patent 20130306148A1, ~ (2013)
- X. Yu, "Thin Czochralski silicon solar cells based on diamond wire sawing technology", Sol. Energy Mater. Sol. Cells, 98, pp.337~ (2012)