Micro blaster를 이용한 태양전지용 재생웨이퍼의 표면 개선에 관한 연구
A study on improving the surface morphology of recycled wafer forsolar cells using micro_blaster
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Recently, recycling method of waste wafer has been an area of solar cell to cut costs. Micro_blasting is one of the promising candidates for recycling of waste wafer due to their extremely simple and cost-effective process. In this paper, we attempt to explore the effect of micro_blasting and DRE(damage removal etching) process for solar cell. The optimal process conditions of micro_blasting are as follows: 10 μm sized Al2O3 powder, jetting pressure of 400 kPa, and scan_speed of 30 cm/s. And the particles formed on micro_blasted wafer were removed by DRE precess which was performed by using HNA(HF/HNO3/CH3COOH) and TMAH(tetramethyl ammonium hydroxide). Structural analysis was done using a-step and the XRD patterns.
Abstract
Recently, recycling method of waste wafer has been an area of solar cell to cut costs. Micro_blasting is one of the promising candidates for recycling of waste wafer due to their extremely simple and cost-effective process. In this paper, we attempt to explore the effect of micro_blasting and DRE(damage removal etching) process for solar cell. The optimal process conditions of micro_blasting are as follows: 10 μm sized Al2O3 powder, jetting pressure of 400 kPa, and scan_speed of 30 cm/s. And the particles formed on micro_blasted wafer were removed by DRE precess which was performed by using HNA(HF/HNO3/CH3COOH) and TMAH(tetramethyl ammonium hydroxide). Structural analysis was done using a-step and the XRD patterns.
참고문헌 (5)
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- 남철우, "The present and future of CMP technology", Prospectives of Industrial Chemistry, 2(3) (1999)
- 이윤호, "마이크로 블라스터를 이용한 태양전 지용 재생웨이퍼에 관한 연구", 전기전자재료학회, 22, pp.276~ (2009)
- H. Y. Park, "Investigation of improving texturing effect by surface saw damage etching using acidic etchant for silicon solar cells", Solar Energy Materials & Solar Cells, 93, pp.1773~1778 (2009)
- 최성호, "Recycled Si Wafer를 이용한 태양전지의 제작과 특성 연구", 센서학회지, 9(1), pp.70~75 (2000)