롤투롤 인쇄공정 적용을 위한 차세대 나노입자 소결 기술
Alternative Sintering Technology of Printed Nanoparticles for Roll-to-Roll Process
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Recently, a variety of printing technologies, including ink jet, gravure, and roll-to-roll (R2R) printing, hasgenerated intensive interest in the application of flexible and wearable electronic devices. However, the actual use ofprinting technique is much limited because the sintering process of the printed nanoparticle inks remains as a huge practicaldrawback. In the fabrication of the conductive metal film, a post-sintering process is required to achieve high conductivityof the printed film. The conventional thermal sintering takes considerable sintering times, and requires high temperatures. For application to flexible devices, the sintering temperature should be as low as possible to minimize the damage ofpolymer substrate. Several alternative sintering methods were suggested, such as laser, halogen lamp, infrared, plasma,ohmic, microwave, and etc. Eventually, the new sintering technique should be applicable to large area, R2R, and polymersubstrate as well as low cost. This article reviews progress in recent technologies for several sintering methods. Theadvantages and disadvantages of each technology will be reviewed. Several issues for the application in R2R process are discussed.
Abstract
Recently, a variety of printing technologies, including ink jet, gravure, and roll-to-roll (R2R) printing, hasgenerated intensive interest in the application of flexible and wearable electronic devices. However, the actual use ofprinting technique is much limited because the sintering process of the printed nanoparticle inks remains as a huge practicaldrawback. In the fabrication of the conductive metal film, a post-sintering process is required to achieve high conductivityof the printed film. The conventional thermal sintering takes considerable sintering times, and requires high temperatures. For application to flexible devices, the sintering temperature should be as low as possible to minimize the damage ofpolymer substrate. Several alternative sintering methods were suggested, such as laser, halogen lamp, infrared, plasma,ohmic, microwave, and etc. Eventually, the new sintering technique should be applicable to large area, R2R, and polymersubstrate as well as low cost. This article reviews progress in recent technologies for several sintering methods. Theadvantages and disadvantages of each technology will be reviewed. Several issues for the application in R2R process are discussed.
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