Use of Local Electrochemical Methods (SECM, EC-STM) and AFM to Differentiate Microstructural Effects (EBSD) on Very Pure Copper
0
조회
0
다운로드
1
인용
0
참고문헌
키워드
초록
When aiming for an increased and more sustainable use of metals a thorough knowledge of the corrosionphenomenon as function of the local metal microstructure is of crucial importance. In this work, we summarizethe information presented in our previous publications[1-3] and present an overview of the different local(electrochemical) techniques that have been proven to be effective in studying the relation between differentmicrostructural variables and their different electrochemical behavior. Atomic force microscopy (AFM)[1],scanning electrochemical microscopy (SECM)[2], and electrochemical scanning tunneling microscopy(EC-STM)[3] were used in combination with electron backscatter diffraction (EBSD). Consequently, correlationscould be identified between the grain orientation and grain boundary characteristics, on the one hand, andthe electrochemical behavior on the other hand. The grain orientation itself has an influence on the corrosion,and the orientation of the neighboring grains also seems to play a decisive role in the dissolution rate. With respect to intergranular corrosion, only coherent twin boundaries seem to be resistant.
Abstract
When aiming for an increased and more sustainable use of metals a thorough knowledge of the corrosionphenomenon as function of the local metal microstructure is of crucial importance. In this work, we summarizethe information presented in our previous publications[1-3] and present an overview of the different local(electrochemical) techniques that have been proven to be effective in studying the relation between differentmicrostructural variables and their different electrochemical behavior. Atomic force microscopy (AFM)[1],scanning electrochemical microscopy (SECM)[2], and electrochemical scanning tunneling microscopy(EC-STM)[3] were used in combination with electron backscatter diffraction (EBSD). Consequently, correlationscould be identified between the grain orientation and grain boundary characteristics, on the one hand, andthe electrochemical behavior on the other hand. The grain orientation itself has an influence on the corrosion,and the orientation of the neighboring grains also seems to play a decisive role in the dissolution rate. With respect to intergranular corrosion, only coherent twin boundaries seem to be resistant.
참고문헌 (32)
- L. Lapeire, , Corros. Sci., 67, pp.179~ (2012)
- E. M. -Lombardia, , Electrochim. Acta, 116, pp.89~ (2014)
- E. M.-Lombardia, , Electrochem. Commun., 41, pp.1~ (2014)
- A. Alfantazi, , Mater. Design, 30, pp.2425~ (2009)
- H.-B. Lu, , Electrochim. Acta, 52, pp.474~ (2006)
- E. Ghali, , J.Mater. Eng. Perform., 13, pp.7~ (2004)
- C. Van den Bos, , Corros. Sci., 48, pp.1483~ (2006)
- F. Andreatta, , Corros. Sci., 45, pp.1733~ (2003)
- C. Caicedo-Martinez, , Corros. Sci., 44, pp.2611~ (2002)
- C. Yao, , J. Alloy. Compd., 602, pp.101~ (2014)
- A. Amirudin, , J. Natl. Sci. Found. Sri, 6, pp.27~ (1978)
- V. Maurice, , J. Phys. Chem. C, 111, pp.16351~ (2007)
- A. Seyeux, , J. Solid State Electr., 9, pp.337~ (2005)
- J. Kunze, , Electrochim. Acta, 48, pp.1157~ (2003)
- M. Vogt, , Surf. Sci., 399, pp.49~ (1998)
- G. Zhou, , Appl. Surf. Sci., 222, pp.357~ (2004)
- F. Wiame, , Surf. Sci., 601, pp.1193~ (2007)
- M. Schweinsberg, , Electrochim. Acta, 42, pp.3303~ (1997)
- B. Davepon, , Surf. Coat. Technol., 169, pp.85~ (2003)
- J. R. Davis, "Copper and copper alloys, p. ?" (2001), ASM international
- S. Kudelka, , Electrochim. Acta, 41, pp.863~ (1996)
- S. Kudelka, , Electrochim. Acta, 42(18), pp.2817~
- Y. Huang, , Acta Mater., 56(7), pp.1619~ (2008)
- T. Konkova, , Acta Mater., 58(16), pp.5262~ (2010)
- T. P. Mo, , J. Electrochem. Soc., 139(11), pp.3158~ (1992)
- Z. Guoding, , Metal. Soc., 8, pp.308~ (1998)
- T. P. Moat, , J. Electrochem. Soc., 139, pp.3158~ (1992)
- J. Kunze, , Corros. Sci., 46, pp.245~ (2004)
- S. Kim, , Scr. Mater., 44, pp.835~ (2001)
- V. Randle, , Scr. Mater., 54, pp.1011~ (2006)
- V. Gertsman, , Acta Mater., 49, pp.1589~ (2001)
- M. Kumar, , W. E. King, Acta Mater., 50, pp.2599~ (2002)