반도체 와이어 본딩 검사용 다중배치 현미경 광학계에 대한 공차분석

Abstract

We have analyzed various tolerances of the multi-configurative microscopic system for inspecting the wire-bonding of a reed frame by using the Gaussian bracket method and the equivalent lens method. The tolerances for the curvature and the thickness, which are axial symmetric tolerances, are given by varying the back focal length within a focal depth under diffraction-limited conditions. Moreover, by using the trial and error method, the axial non-symmetric tolerances for decenter and tilt are established by assigning the 5% variation of MTF(modulation transfer function) at the spatial frequency of 50 lp/mm and at the field angle of 0.7 field. As the tolerances with the most probable distribution are distributed within the range of the decay rate of less than 5% independent of the probability distribution of tolerances, we can achieve completely the desired design performances of the multi-configurative microscopic system by using the various ranges of these tolerances.