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역비중침강법을 이용한 폐PCB 연삭분진의 금속성분 분리

Separation of Metal Components from Abrasion Powder by Using Reverse of Gravity Sedimentation Method

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키워드

주제분류자원공학

초록

WPCB에 포함된 주요금속(Cu, Fe), 귀금속(Au, Ag)뿐만 아니라 미량의 금속성분을 회수하고 유해금속의 처리효율을 증가시키기 위한 연구로, 본 연구그룹에서는 기계적 연삭법을 이용해 전기전자부품을 탈거시키는 연구를 발표하였다. 폐PCB는 연삭처리를 통해, 부품이 탈거된 기판(dismantled PCB), 탈거된 전기전자부품(electric/electronic components, EECs) 그리고 연삭분진(abrasion powder)으로 회수되었다. 본 연구에서는 금속성분이 29.8wt% 함유된 연삭분진으로부터 금속성분을 분리하기 위해 역비중침강법(Elutriation method, reverse of gravity sedimentation)을 이용하였다. +100 mesh 분진의 경우, 액상매질 상승속도 7 mm/s, 튜브높이 100 mm 에서 금속품위 91.5%, 회수율 97.5%로 회수가 가능하였고, 반면에 ‒200 mesh구간 분진의 경우는 액상매질 상승 속도 및 튜브의 높이 변화에 따른 금속성분의 품위 및 회수율의 차이가 거의 나타나지 않았으며 액상매질 상승속도 1 mm/s, 튜브 높이 100 mm조건에서 35.7%의 금속품위 및 28.9%의 회수율을 나타내었다. 이는 연삭분진의 입자크기가 작아짐에 따라 금속/비금속성분 입자간 종말 침강속도의 차이가 감소되어 액상매질과 동시에 동반 부유된 결과로 판단된다.

Abstract

In previous research, our research group has studied about disassembly of electric/electronic components from wasted printed circuit boards (WPCBs) by using surface grinding method. During this procedure, 13.9 wt% of WPCBs was occurred to abrasion powders, which contained a mess of metals about 29.8 wt%. As a subsequent research, the authors have tested for elutriation method (reverse of gravity sedimentation) to separation of metal phase components from the abrasion powder. As for the range of +100 mesh size in abrasion powder, 97.5 wt% of metals could be recovered at a 7 mm/s of upward-velocity in liquid-phase medium, the tube height of 100 mm. whereas, in the case of +100 mesh size in powder, metal recovery decreases with a decrease of powder sizes. And also, in the case of ‒200 mesh, the recovery was 28.9% at a velocity of 1 mm/s, the tube height of 100 mm. This implies the settling velocity and its gap between metal and non-metal components decrease in proportion to their sizes.

참고문헌 (15)

  1. Das, A., "A noble flowsheet for the recovery of metal value from waste printed circuit boards", Resources, Conservation and recycling, 53, pp.464~469 (2009)
  2. Duan, C.L, "Recovery of metals from waste printed circuit boards by mechanical method using a water medium", J. of Hazardous Materials, 166, pp.478~482 (2009)
  3. Duan, H.b, "Examining the technology acceptance for dismantling of waste printed circuit boards in light of recycling and environmental concerns", J. of Environmental Management, 92, pp.392~399 (2011)
  4. Eswaraiah, C, "Classification of metals and plastics from printed circuit board(PCB) using air classifier", Chemical Engineering and Processing, 47, pp.565~576 (2008)
  5. Guo, C., "Liberation characteristic and physical separation of printed circuit board(PCB)", Waste Management, 31, pp.2161~2166 (2011)
  6. Hettler, E.N, "An elutriation device to measure particle settling velocity in urban runoff", Science of the Total Environment, 409, pp.5444~5453 (2011)
  7. 김영진, "폐PCB에 장착된 전기", 전자부품의 분리 및 특성, 2012, pp.49(6), 728~735[DOI]
  8. Vinod Kumar, "Review on Mechanical Recycling of End-of-Life Electrical and Electronic Equipments for Recovery of Metallic Components", 한국자원공학회지, 47(5), pp.593~608 (2010), 한국자원공학회
  9. Lee, J.R, "Disassembly and physical separation of electric", electronic components layered in printed circuit boards (PCB), 2012, pp.241-242, 387~394
  10. Li, J.H., "Status quo of e-waste management in mainland China", J. of Mater cycles Waste Management, 8(1), pp.13~20 (2006)
  11. Murugan, R.V., "Milling and separation of the multi-component printed circuit board materials and the analysis of elutriation based on a single particle model", Powder Technology, 183, pp.169~176 (2008)
  12. Wills, B.A, "WILLS` Mineral Processing Technology", pp.101~ (2006), Butterworth-Heinemann
  13. Wu, G.Q., "Recycling of waste printed circuit boards", Circuit world, 36(4), pp.35~39 (2010)
  14. Wu, J., "Electrostatics separation for multi-size granule of crushed printed circuit board waste using two-roll separation", J. of Hazardous Materials, 159, pp.230~234 (2008)
  15. Yoo, J.M., "Enrichment of the metallic component from waste printed circuit boards by a mechanical separation process using stamp mill", Waste Management, 29, pp.1132~1137 (2009)

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