시스템 반도체 패키지 기판사업의 CS 평가 척도 개발을 위한 통계적 검증 연구

Abstract

Purpose: The purpose of this study is to develop a systematic Customer Satisfaction (CS) evaluation scale tailored to the system semiconductor package substrate industry. Specifically, it aims to identify key Business-to-Business (B2B) service quality factors and construct an evaluation framework by applying the Quality Function Deployment (QFD) methodology. Methods: Based on a review of prior studies, the evaluation framework was derived to include four major dimensions: economic factors, technical factors, transaction efficiency, and customer relationship management. The content validity of the framework was verified through expert panel evaluation, followed by exploratory factor analysis (EFA) and confirmatory factor analysis (CFA) to examine reliability and validity. Results: The empirical analysis revealed that the CS evaluation scale consists of four main categories and fifteen sub-factors. EFA identified customer evaluation, customer profitability, process/technology, and supply/efficiency as the core dimensions, while CFA confirmed that the model fit indices (RMSEA=0.029, CFI=0.805) met acceptable levels. Among these, customer relationship management and economic factors were found to exert the strongest influence on CS. Conclusion: This study contributes to the literature by extending B2C-oriented service quality research into the B2B semiconductor packaging context and by proposing a validated QFD-based CS evaluation scale. Practically, the results highlight the importance for package substrate companies to strengthen customer trust, improve responsiveness, and balance cost efficiency with long-term relationship management in order to secure sustainable competitiveness in the global semiconductor supply chain.