E-mobility용 고밀도 전원장치의PCB방열 특성해석에 관한 연구

Abstract

This paper presents the PCB heat dissipation characteristics of high density DC-DC converter for electric vehicles. This paper also analyzes the heat dissipation structure of the high density DC-DC converter and optimizes the PCB heatdissipation design of the high density power system through thermal analysis simulation. Based on heat transfer theory,the thermal path of general electronic devices is analyzed and the thermal resistance equivalent circuit is modeled in thispaper. Additionally, the thermal resistance equivalent circuit of the 500W synchronous buck converter, which is addressedin this paper, is modeled to present a structural heat dissipation path for better thermal performance. The validity of theproposed scheme is verified through the thermal analysis simulation results and experiments applying multi-surface heatdissipation structure to a 500[W](12[V], 41.67[A]) synchronous buck converter prototype with an input voltage 72[V].