전기도금한 교정용 스테인레스스틸 선재의 세포독성에 관한 연구
Evaluation of cytotoxicity of electroplated stainless steel orthodontic wire
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본 연구는 전기도금을 이용하여 교정용 스테인레스스틸 선재의 직경을 증가시킨 후 세포독성을 알아봄으로써 이의 임상적 적용 가능성을 알아보고자 시행되었다. 시판되고 있는 교정용 스테인레스스틸 선재에 전기도금 방법을 이용하여 니켈을 도금한 후, 이를 도금하지 않은 교정용 스테인레스스틸 선재 그리고 티타늄 또는 구리와 비교하기 위하여 이들을 배지에 넣고 72시간 배양하였다. 이 배양액을 금속 유리량 측정을 위해 ICP-AES (inductively coupled plasma atomic emission spectrophotometer) 분석을 시행한 결과 전기도금한 선재에서 많은 양의 니켈 이온이 유리되었으며, 구리에서는 많은 양의 구리 이온이 유리되었다. Microplate에 Balb/c 3T3 mouse fibroblast를 넣고 각 선재를 배양한 배양액을 75%, 50%, 25%로 희석시켜 첨가한 후 MTT (3-[4,5- dimethylthiazol-2yl]-2,5-diphenyl tetrazolium bromide) 분석을 시행하여 이를 배지만을 첨가한 경우와 흡광도를 비교하였다. 티타늄은 모든 농도에서 배지만을 첨가한 경우에 비해 흡광도 차이를 보이지 않았지만 전기도금한 선재 (p < 0.001), 스테인레스스틸 선재 (p < 0.05), 구리 (p < 0.001) 는 배지만을 첨가한 경우보다 통계적으로 유의한 흡광도 감소를 보였다. ISO 10993, part 5에 따라 구리는 “강한 독성”을 보이는 반면 티타늄과 스테인레스스틸 선재는 “무독성”, 그리고 전기도금 선재는 “중등도 독성”으로 나타났다. 이상의 결과는 전기도금을 이용하여 교정용 선재의 직경을 증가시키는 방법이 임상에 적용되기 위해서는 세포독성을 줄이기 위한 추가의 연구가 필요함을 시사하였다.
Abstract
The purpose of this study was to examine the cytotoxicity of orthodontic wire which had an increased diameter through electroplating, and to evaluate its possible clinical applications. First, nickel plating was carried out on the commercially available stainless steel wire using an electroplating technique. For the comparison of the electroplated wire with ready made stainless steel wire and titanium or copper, each wire was incubated for 72 hours in a medium. The release of the metal ion was measured using ICP-AES (Inductively Coupled Plasma Atomic Emission Spectrophotometer). Balb/c 3T3 mouse fibroblast was put on a microplate and placed in an incubated medium of 75%, 50%, and 20% dilation. An MTT analysis was used to compare with the medium only. The change in absorbency value of each wire group and the difference of absorbency value according to the change of dilution was measured. The results of ICP-AES analysis showed that great amount nickel ion was isolated from electroplated orthodontic wires and great amount copper ion was isolated from copper. The results of the MTT analysis showed that there was no difference in the absorbency value of titanium at any dilution. However, the electroplated wires (p < 0.001), the stainless steel wires (p < 0.05) and the copper (p < 0.001) were statistically significantly lower than those of medium only at all dilutions. Assessment as per ISO 10993, part 5, showed that electroplated wire was alloted to “moderate cytotoxic”, the titanium and stainless steel wire were “non-cytotoxic”. The results of this study indicate that the electroplated orthodontic wires need additional efforts to decrease cytotoxicity for their clinical applications.
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