불소수지의 무전해 동도금을 위한 단계적 플라즈마 전처리법에 관한 연구

Abstract

Low temperature plasma treatment with different gases and rf powers were performed to improve the adhesion strength between polytetrafluoroethylene(PTFE) and electroless deposited copper. According to the research, H2 plasma having hydrogen radical was more effective in surface polarity modification than O2 plasma due to the defluorination reaction. However, surface roughness of PTFE was more increased with O2 than H2 plasma. PTFE treated with 120W-O2 plasma and 250W-H2 plasma, consecutively showed rougher surface than single step 250W-H2 plasma treated one and more hydrophilic than single step 120W-O2 plasma treated one. And it showed 5B tape test grade, which is better adhesion property than 1B or 3B obtained by single step plasma treatment. In addition, adhesion strength between PTFE and Cu deposit is also deeply affected by residual water on its interface.