Effect of Sulfuric Acid Concentration on Corrosion Between Au or Cu Bonding Wire and Pads for Semiconductor Packaging
0
조회
0
다운로드
0
인용
0
참고문헌
키워드
초록
Wire bonding is still prevalent in conventional semiconductor packaging. However, degradation can occurduring use or storage due to factors such as humidity, acidity, and ionic contamination. This study investigates the corrosion behavior of packaging structures with Al and Au bond pads combined with Au and Cu wires in sulfate-based environments. Electrochemical evaluations, including individual polarization and galvanic tests, were performed in de-aerated 1% Na2SO4 solutions with varying H2SO4 concentrations. Tafel analysis provided data on corrosion potential (Ecorr), corrosion current density (icorr), galvanic potential/current density, and total charge. Additionally, a Temperature-Humidity Test (85 oC/85% RH) was conducted under 1% Na2SO4 with either 0% or 1% H2SO4 conditions, using PCB unit specimens that featured a 1st ball bond on an Al pad and a 2nd stitch bond on an Au pad, bonded with either Au or Cu wires. The surface morphology and elemental distribution were qualitatively analyzed before and after exposure using a 3D optical microscope and FE-SEM/EDS.
Abstract
Wire bonding is still prevalent in conventional semiconductor packaging. However, degradation can occurduring use or storage due to factors such as humidity, acidity, and ionic contamination. This study investigates the corrosion behavior of packaging structures with Al and Au bond pads combined with Au and Cu wires in sulfate-based environments. Electrochemical evaluations, including individual polarization and galvanic tests, were performed in de-aerated 1% Na2SO4 solutions with varying H2SO4 concentrations. Tafel analysis provided data on corrosion potential (Ecorr), corrosion current density (icorr), galvanic potential/current density, and total charge. Additionally, a Temperature-Humidity Test (85 oC/85% RH) was conducted under 1% Na2SO4 with either 0% or 1% H2SO4 conditions, using PCB unit specimens that featured a 1st ball bond on an Al pad and a 2nd stitch bond on an Au pad, bonded with either Au or Cu wires. The surface morphology and elemental distribution were qualitatively analyzed before and after exposure using a 3D optical microscope and FE-SEM/EDS.