전투차량용 계기판 내부습기 방지를 위한 최적설계 방안에 관한 연구
A Study on Optimal Design Method to Prevent Moisture for Combat Vehicles
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초록
The battle vehicle has six types of indicators attached to the instrument panel in consideration of the special battlefield environment. However, many problems of moisture occurred during the operation of combat vehicles. These moisture phenomena can adversely affect aesthetics and functionality. Moisture is generated on the instrument panel due to the inflow of external moist air, the desorption of the moist air inside the parts, and the fluctuation of the dew point temperature. In this paper, we try to derive the root cause of various moisture generation and provide an improvement measures for moisture control. Therefore, the failure mechanism of the instrument panel may be analyzed and the design may be changed depending on the failure factor. Furthermore, the effect of the design change is verified, and the humidity performance is evaluated.
Abstract
The battle vehicle has six types of indicators attached to the instrument panel in consideration of the special battlefield environment. However, many problems of moisture occurred during the operation of combat vehicles. These moisture phenomena can adversely affect aesthetics and functionality. Moisture is generated on the instrument panel due to the inflow of external moist air, the desorption of the moist air inside the parts, and the fluctuation of the dew point temperature. In this paper, we try to derive the root cause of various moisture generation and provide an improvement measures for moisture control. Therefore, the failure mechanism of the instrument panel may be analyzed and the design may be changed depending on the failure factor. Furthermore, the effect of the design change is verified, and the humidity performance is evaluated.
참고문헌 (5)
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- B. K. Choi, "Development of 1-D Program for Predicting Defogging Performance of Automotive Lamp", The Korean Society of Mechanical Engineers, pp.933~934 (2018)
- J. H. Lim, "Reliability and moisture effects of electronic parts plastic package", Journal of the Korean Society of Mechanical Engineers, 52(7), pp.45~49 (2012)