소형 Chip Land PCB 일어섬 불량 원인 분석 및 개선 방안 연구

Abstract

As military equipment becomes more precise, functional, and miniaturized, the size of the boards used is also trending toward miniaturization. Until three years ago, the main products developed by Seorim Technology Co., Ltd. were boards with an outer surface of over 20 cm; however, currently, more than 80% of the products produced are small boards with sizes of 500 won. Even if the equipment has the same function, when its size is reduced, the internal PCB and its components must be precise and miniaturized. The problem that arises currently is an increase in the design and process defect rates. First, most defects often start from design errors. Second, during the manufacturing process, they occur because of variables such as manufacturing, fixture design, and precision errors within the process, which can lead to product performance deterioration or, in some cases, disposal. This is necessary in certain cases. In this study, we selected a scope and studied the fundamental analysis and improvement of defects that may occur during the development and production of ultra-small parts inside the signal-processing board of the K-15 light machine gun-aiming device used in the military. Consequently, the tombstone (Manhattan) of the 0603 chip land components, using 200 points, accounted for the largest part, and this could have a significant impact on the timing of electrification; therefore, intensive improvement research began. Furthermore, we aim to predict the defects that may occur during the design and production of small parts in advance and provide solutions for these problems.