Study on the recognition of the marks for low-energy microcolumn lithography
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Electron beam lithography has been paid great attention as a future lithography technology for the patterning of extremely fine structures. Generally e-beam lithography means high-energy e-beam lithography where the kinetic energies of electrons are rather high(10-100 keV). Although high-energy e-beam technology is mature and being used in the semiconductor industry, low-energy microcolumn lithography(LEML) has many great advantages as a next-generation technology, which explains the active research on the subject these days. In this study, we developed a new method to recognize the registration marks in LEML. With this novel method, there is no need to supply a bias to the mark electrodes, which remarkably simplifies the fabrication process of IC devices.
Abstract
Electron beam lithography has been paid great attention as a future lithography technology for the patterning of extremely fine structures. Generally e-beam lithography means high-energy e-beam lithography where the kinetic energies of electrons are rather high(10-100 keV). Although high-energy e-beam technology is mature and being used in the semiconductor industry, low-energy microcolumn lithography(LEML) has many great advantages as a next-generation technology, which explains the active research on the subject these days. In this study, we developed a new method to recognize the registration marks in LEML. With this novel method, there is no need to supply a bias to the mark electrodes, which remarkably simplifies the fabrication process of IC devices.
참고문헌 (5)
- U. Weidenmueller, , Microelectronic Engineering, 78, pp.16~21 (2005)
- L. Pain, , Microelectronic Engineering, 83, pp.749~753 (2006)
- H.S. Kim, , Microelectronic Engineering, 83, pp.962~967 (2006)
- T.H.P. Chang, , International cinference of Micro- And Nano- Engineering (2000)
- H.S. Kim, "Sub-60-nm Lithography Patterns by Low-Energy Microcolumn Lithography", Journal of the Korean Physical Society, 49(III), pp.712~715 (2006), 한국물리학회