Effect of gold wire bonding on optical performance of high power light-emitting diode packaging
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Gold wire bonding is an essential process of light-emitting diode (LED) packaging. This work aims to study the effect of gold wire shape and height on optical performance of LED package with freely dispersed phosphor layer. Three types of wire bonding are discussed. The geometry of phosphor layer affected by gold wires is simulated based on microfluidics theory. Simulation results show that different gold wire bonding affects the geometry of phosphor layer differently. When the outside part of gold wire is lower and closer to the surface of phosphor gel, the geometry will be impacted seriously and it results in obvious fluctuation trends of angular correlated color temperature (CCT) at different spatial planes in LED package. However, gold wire bonding has slight impact on the distribution of light intensity in the package. In the manufacturing process, the gold wire bonding process should be further designed and optimized for better LED products.
Abstract
Gold wire bonding is an essential process of light-emitting diode (LED) packaging. This work aims to study the effect of gold wire shape and height on optical performance of LED package with freely dispersed phosphor layer. Three types of wire bonding are discussed. The geometry of phosphor layer affected by gold wires is simulated based on microfluidics theory. Simulation results show that different gold wire bonding affects the geometry of phosphor layer differently. When the outside part of gold wire is lower and closer to the surface of phosphor gel, the geometry will be impacted seriously and it results in obvious fluctuation trends of angular correlated color temperature (CCT) at different spatial planes in LED package. However, gold wire bonding has slight impact on the distribution of light intensity in the package. In the manufacturing process, the gold wire bonding process should be further designed and optimized for better LED products.
참고문헌 (18)
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