무전해 도금법을 이용한 전자소재용 은-구리 복합분말의 제조
Synthesis of Ag-Cu Composite Powders for Electronic materials by Electroless Plating Method
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초록
Silver coated copper composite powders were prepared by electroless plating method by controlling the activation and deposition process variables such as feeding rate of silver ions solution, concentration of reductant and molar ratio of activation solution (NH₄OH/(NH₄)₂SO₄) at room temperature. The characteristics of the product were verified by using a scanning electron microscopy (SEM), X-ray diffraction (XRD) and atomic absorption (A.A.). It is noted that completely cleansing the copper oxide layers and protecting the copper particles surface from hydrolysis were important to obtain high quality Ag-Cu composite powders. The optimum conditions of Ag-Cu composite powder synthesis were NH₄OH/(NH₄)₂SO₄ molar ratio 4, concentration of reductant 15 g/l and feeding rate of silver ions solution 2 ml/min.
Abstract
Silver coated copper composite powders were prepared by electroless plating method by controlling the activation and deposition process variables such as feeding rate of silver ions solution, concentration of reductant and molar ratio of activation solution (NH₄OH/(NH₄)₂SO₄) at room temperature. The characteristics of the product were verified by using a scanning electron microscopy (SEM), X-ray diffraction (XRD) and atomic absorption (A.A.). It is noted that completely cleansing the copper oxide layers and protecting the copper particles surface from hydrolysis were important to obtain high quality Ag-Cu composite powders. The optimum conditions of Ag-Cu composite powder synthesis were NH₄OH/(NH₄)₂SO₄ molar ratio 4, concentration of reductant 15 g/l and feeding rate of silver ions solution 2 ml/min.
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