패치 구조를 이용한 D-Band(140 GHz - 160 GHz) 대역 도파관-마이크로스트립 변환기의 광대역 설계
Broadband Waveguide-to-Microstrip Transition Design Using Patch Structure in the D-Band(140 GH -160 GHz)
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초록
본 논문에서는 D-band(140 GHz-160 GHz) 대역을 충족시키는 밀리터리파 집적회로용 도파관-마이크로스트립 변환기를 설계하였다. 제안된 변환기는 WR-7 규격 도파관에서 전파된 신호를 기판 집적 도파관(Substrate Integrated Waveguide, SIW)을 통해 손실을 최소화하여 마이크로스트립으로 전달하는 수직 구조로 설계되었다. 모드 변환을 효율적으로 하기 위해 규격 도파관과 SIW 사이에 패치를 삽입하였다. Ansoft사의 HFSS를 이용한시뮬레이션에서 패치 크기와 Pin의 위치를 조정하여 주파수 특성 변화를 확인하였고 광대역으로 설계하였다. 설계에 사용된 기판은 Taconic RF-35로 유전율 3.5(손실 탄젠트 0.0018)와 두께 0.254 mm를 갖는다. 시뮬레이션결과 124 GHz에서 163 GHz까지의 대역폭을 확보하였으며, 해당 대역에서 평균 삽입 손실 -0.9 dB 이하, 평균반사 손실 –10 dB 이하의 성능을 보였다.
Abstract
This paper presents the design of a waveguide-to-microstrip transition for millimeter-wave integrated circuits that fulfills the requirements of the D-band (140 GHz–160 GHz). The proposed transition is vertically structured to minimize loss, transferring signals that propagate from a WR-7 standard waveguide to a microstrip via a substrate integrated waveguide (SIW). To enable efficient mode conversion, a patch is inserted between the standard waveguide and SIW. Using HFSS from Ansoft, the frequency characteristics were analyzed by adjusting the patch size and position of the pin, achieving a wideband design. The substrate used for the design is Taconic RF-35, with a dielectric constant of 3.5 (loss tangent 0.0018) and a thickness of 0.254 mm. Simulation results demonstrate a bandwidth from 124 GHz to 163 GHz, with an average insertion loss of -0.9 dB or less and an average return loss of -10 dB or less across the band.
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