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Thermal Transient Characteristics of Die Attachin High Power LED PKG

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참고문헌 (9)

  1. "Measuring thermal resistance is the key to a cool semiconductor", 51, pp.121~126 (1978)
  2. "Thermal issues in stacked die packages"
  3. "Die attach quality control of 3D stacked dies", 78-84, pp.~16
  4. "Structure function evaluation of stacked dies", pp.50~55
  5. "Highly reliable Au-Sn eutectic bonding with background GaAs LSI chips", 14(3) (1991)
  6. "A new evaluation method of thermal transient measurement results", 28(3), pp.277~292 (1997)
  7. "Analysis of thermal transient data with synthetized dynamic models for semiconductor devices", 18(1), pp.39~47 (1995)
  8. "Efficient Approach to Thermal Modeling for IC Packages", 6(1), pp.31~ (1999)
  9. "A Study on the Thermal Behaviour of Via Design in the Ceramic Package", 10(1), pp.39~ (2003)

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