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무연솔더 접합부 특성향상을 위한 나노복합솔더 기술

Nano-Composite Solder Technology for the Improvement of Solder Joint Properties

이영규|이창우|유세훈|기원명
한국마이크로전자및패키징학회 (The Microelectronics And Packaging Society)|2011.09|마이크로전자 및 패키징학회지 (Jornal of the Microelectronics and Packaging Society)|제18권 제3호|pp. 9-17

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참고문헌

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초록

Nano-composite solders have been studied to improve the properties of Pb-free solder joints. The nanoparticles in the composite solders were carbon nanotubes(CNTs), metals (Ag, Ni, Cr, etc.), ceramics (SiC, ZrO2, TiB2,etc.). To fabricate the nano-composite solders, mechanical mixing methods and in-situ fabrication method has been used for well-dispersed nano phase. The characteristic properties of the nano-composite solders were high creep resistance,low undercooling, low IMC growth rate and fine microstructures. More researches on the nano-composite solders are required to improve the processibility and the reliability of the nano-composite solder joints.

Abstract

Nano-composite solders have been studied to improve the properties of Pb-free solder joints. The nanoparticles in the composite solders were carbon nanotubes(CNTs), metals (Ag, Ni, Cr, etc.), ceramics (SiC, ZrO2, TiB2,etc.). To fabricate the nano-composite solders, mechanical mixing methods and in-situ fabrication method has been used for well-dispersed nano phase. The characteristic properties of the nano-composite solders were high creep resistance,low undercooling, low IMC growth rate and fine microstructures. More researches on the nano-composite solders are required to improve the processibility and the reliability of the nano-composite solder joints.

참고문헌 (36)

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