시효처리에 따른 Cu를 포함하는 Sn계 무연솔더와 백금층 사이의 금속간화합물 성장
Intermetallic Compounds Growth in the Interface between Sn-based Solders and Pt During Aging
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초록
무연솔더 Sn0.7wt%Cu, Sn3.8wt%Ag0.7wt%Cu 솔더와 Pt층의 시효처리에 따른 계면반응에 대한 연구를 수행하였다. 250oC에서 30 초간 리플로한 Sn3.8wt%Ag0.7wt%Cu/Pt시편과, 260oC에서 30초간 리플로한 Sn0.7wt%Cu/Pt 시편을 이용하여 125, 150, 170oC에서 25-121 시간 동안 시효처리 하였다. 시효처리 온도와 시간에 따른 계면 금속간화합물의 두께 및 형상변화를 주사전자현미경 (scanning electron microscopy, SEM), energy dispersive x-ray spectroscopy (EDS) 및 x-ray diffractometry (XRD)를 이용하여 분석하였다. 분석 결과 계면에서 PtSn4, PtSn2가 발견되었고, 이런 금속간화합물 성장은 확산에 의해 지배됨을 발견하였다. 시효처리 온도와 시간에 따른 금속간화합물의 두께 변화를 이용하여 각 솔더에서의 계면 금속간화합물의 생성 활성화 에너지를 구해본 결과 Sn3.8wt%Ag0.7wt%Cu/Pt는 145.3 kJ/mol, Sn0.7wt%Cu/Pt는 165.1 kJ/mol의 값을 가지고 있었다.
Abstract
Interfacial reaction of Pb-free Sn0.7wt%Cu and Sn3.8wt%Ag0.7wt%Cu solders and Pt during aging has been investigated. After the Sn3.8wt%Ag0.7wt%Cu/Pt specimens were reflowed at 250C for 30s and the Sn0.7wt%Cu/Pt specimens were reflowed at 260C, the specimens were aged at 125C, 150C and 170C for 25-121 hours. The intermetallic thickness and morphology change during aging were characterized using SEM, EDS and XRD. PtSn and PtSn were observed in the solder/Pt interface and the intermetallic formation was governed by diffusion. The activation energy of intermetallic formation was 145.3kJ/mol for Sn3.8wt%Ag0.7wt%Cu/Pt specimens for Sn0.7wt%Cu/Pt specimens from the measurement of the intermetallic thickness with aging temperature and time.
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