Flexible PCB용 무전해 도금 Ni 박막/Polyimide 계면파괴에너지 평가
Interfacial fracture Energy between Electroless Plated Ni film and Polyimide for Flexible PCB Applications
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초록
폴리이미드 표면에 대한 습식 개질전처리 조건에 따른 폴리이미드와 무전해 도금 Ni 박막 사이의 계면파괴에너지를 180o 필 테스트를 통해 정량적으로 구하였다. KOH처리시간이 1분인 경우 계면파괴에너지는 24.5g/mm에서 5분 처리 시 33.3g/mm로 증가하였고, EDA처리 시간이 1분인 경우 31.6g/mm에서, 5분 처리 시 22.3g/mm로 저하되었다. 이러한 습식 개질전처리 조건에 따른 폴리이미드 표면 거칠기 변화는 매우 작아서, 기계적 고착 효과는 계면파괴에너지 변화에 기여하지 못했음을 알 수 있다. KOH는 carboxyl기, EDA는 amine기를 폴리이미드 표면에 형성시켜 Ni과 강한 화학적 결합을 이루어, 폴리이미드 내부의 cohesive 박리거동을 보였다. 습식 개질전처리 조건에 따른 계면파괴에너지의 거동은 파면 부근에 형성된 O=C-O결합과 매우 밀접한 연관성이 있는 것으로 판단된다.
Abstract
: It is investigated how KOH and Ethylenediamine(EDA) treatment conditions on Polyimide film surface affect the interfacial fracture energy between electroless plated Ni and Polyimide film by 180o peel test. Estimated values of interfacial fracture energy were 24.5g/mm and 33.3g/mm for the KOH treatment times under 1 and 5 minutes, respectively, while, those were 31.6g/mm and 22.3g/mm for EDA treatment times under 1 and 5 minutes, respectively. Interfacial bonding between electroless plated Ni and Polyimide seems to be dominated by chemical bonding effect rather than mechanical interlocking effect. It is found that chemical treatment produces carboxyl and amine functional groups which are closely related the interfacial bonding mechanism. Finally, it is speculated that interfacial fracture energy seems to be controlled by O=C-O bonding near cohesive failure region.
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