Si 칩에 형성된 박막히터를 이용한 Chip-on-Glass 공정
Chip-on-Glass Process Using the Thin Film Heater Fabricated on Si Chip
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Si 칩에 박막히터를 형성하고 이에 전류를 인가하여 LCD (liquid crystal display) 패널의 유리기판은 가열하지 않으면서 Si 칩만을 선택적으로 가열함으로써 Si 칩을 LCD 패널의 유리기판에 실장하는 새로운 COG 공정기술을 연구하였다. 5mm x 5mm 크기의 Si 칩에 마그네트론 스퍼터링법으로 폭 150㎛, 두께 0.8㎛, 전체 길이 12.15mm의 정방형 Cu 박막히터를 형성하였으며, 이에 0.9A의 전류를 60초 동안 인가하여 Si 칩의 Sn-3.5Ag 솔더범프를 리플로우 시킴으로써 Si 칩을 유리기판에 COG 본딩하는 것이 가능하였다.
Abstract
: New Chip-on-glass technology to attach an Si chip directly on the glass substrate of LCD panel was studied with local heating method of the Si chip by using thin film heater fabricated on the Si chip. Square-shaped Cu thin film heater with the width of 150m, thickness of 0.8m, and total length of 12.15mm was sputter-deposited on the 5mm5 mm Si chip. With applying current of 0.9A for 60 sec to the Cu thin film heater, COG bonding of a Si chip to a glass substrate was successfully accomplished with reflowing the Sn-3.5Ag solder bumps on the Si chip.
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