본문 바로가기
KERD
논문KCI 등재

자동차 전장용 무연 솔더 기술

Lead-free Solder Technology and Reliability for Automotive Electronics

0

조회

0

다운로드

5

인용

0

참고문헌

키워드

주제분류재료공학

초록

In this study, properties of Pb-free solders for automotive electronics parts were discussed. Lead-free solders for electronics became important after RoHS (Restriction of the use of certain Hazardous Substances) to avoid environmental pollution. Also the growing electronic rate in automotive parts and ELV (End-of Life Vehicles) make Pbfree solder for automotive electronics to be inevitable trend. Definitely, Pb-free solder for automotive electronics should have good wettability, basic strength, but need more reliability than other solders, since it has harsh condition like high temperature, humidity and engine vibration. Thus, shear strength test, thermal shock, drop test and many others are needed to ensure the high reliability. This study describes the properties and requirements of Pb-free solders for automotive electronics.

Abstract

In this study, properties of Pb-free solders for automotive electronics parts were discussed. Lead-free solders for electronics became important after RoHS (Restriction of the use of certain Hazardous Substances) to avoid environmental pollution. Also the growing electronic rate in automotive parts and ELV (End-of Life Vehicles) make Pbfree solder for automotive electronics to be inevitable trend. Definitely, Pb-free solder for automotive electronics should have good wettability, basic strength, but need more reliability than other solders, since it has harsh condition like high temperature, humidity and engine vibration. Thus, shear strength test, thermal shock, drop test and many others are needed to ensure the high reliability. This study describes the properties and requirements of Pb-free solders for automotive electronics.

참고문헌 (26)

  1. 고용호, "자동차 전장 보드용 고온 무연 솔더의 신뢰성 평가", 마이크로전자 및 패키징학회지, 17(4), pp.35~40 (2010), 한국마이크로전자및패키징학회
  2. S. I. Son, "A Study on Tensile Characteristic of QFP Lead-free Joint for Automotive Electrical Parts", KSPE, pp.1103~1110 (2010)
  3. "Electronics in automotive"[URL]
  4. 이성희, "반복겹침접합압연법에 의한 초미세립 고강도 금속재료의 제조기술", 대한용접접합학회지, 25(3), pp.12~17 (2007), 대한용접접합학회
  5. "Drop Shape Analysis"[URL]
  6. "Reliability Testing Procedures"[URL]
  7. "Solder wettability test"[URL]
  8. 함종오, "고강도 볼트의 수소취성에 대한 민감도 측정방법", 대한금속·재료학회지, 49(1), pp.1~8 (2011), 대한금속·재료학회
  9. "JEDEC Solid State Tech. Association", JESD22-B117A, ~ (2006)
  10. 유정희, "플립 칩 BGA 솔더 접합부의 열사이클링 해석", 마이크로전자 및 패키징학회지, 10(1), pp.8~50 (2003), 한국마이크로전자및패키징학회
  11. 이영곤, "Sn-3.0wt.%Ag-0.5wt.%Cu 솔더 볼 접합부의 고속전단 특성", 대한금속·재료학회지, 47(9), pp.580~585 (2009), 대한금속·재료학회
  12. Santosh Kumar, "Analysis of high speed shear characteristics of Sn-Ag-Cu solder joints", Electronic Materials Letters, 7(4), pp.365~373 (2011), 대한금속·재료학회
  13. 정도현, "고속전단시험의 표준화를 위한 Sn3.0Ag0.5Cu 솔더볼의 전단특성", 마이크로전자 및 패키징학회지, 18(1), pp.35~39 (2011), 한국마이크로전자및패키징학회
  14. 이왕구, "다양한 UBM층상의 Sn1.0Ag0.5Cu 솔더 범프의 고속 전단특성에 미치는 전단속도의 영향", 대한금속·재료학회지, 49(3), pp.237~242 (2011), 대한금속·재료학회
  15. Young-Gon Lee, "Electrodeposition of the Sn-58 wt.%Bi Layer for Low-Temperature Soldering", Metals and Materials International, 17(1), pp.117~121 (2011), 대한금속·재료학회
  16. M. H. Roh, "Electroplating Characteristics of Sn-Bi Microbumps for Low-Temperature Soldering", IEEE Transactions on componenets Packaging and Manufacturing Technology, 3(4), pp.566~ (2013)
  17. S. C. Hong, "High Speed Cu-Ni Filling into TSV for 3-Dimensional Si Chip Stacking", Met. Mater. Int, 18(1), pp.123~ (2013)
  18. W. H. Song, "Finite Element Modeling of Simultaneous Ultrasonic Bumping With Au Balls", J. Electronic Packaging, pp.131~ (2009)
  19. M. H. Roh, "Extrusion Suppression of TSV Filling Metal by Cu-W electroplating for Three-Dimensional Microelectronic Packaging", Metall. and Mat. Trans. A (2015)
  20. 노명훈, "플립칩 패키징용 Sn-0.7Cu 전해도금 초미세 솔더 범프의 제조와 특성", 대한금속·재료학회지, 49(5), pp.411~418 (2011), 대한금속·재료학회
  21. 홍성준, "비아 홀(TSV)의 Cu 충전 및 범핑 공정 단순화", 마이크로전자 및 패키징학회지, 17(3), pp.79~84 (2010), 한국마이크로전자및패키징학회
  22. 방정환, "자동차 전장모듈용 Sn-Cu-Cr(Ca) 중온 솔더의 접합특성 연구", 대한용접접합학회지, 31(5), pp.54~58 (2013), 대한용접접합학회
  23. Santosh Kumar, "Soft Error Issue and Importance of Low Alpha Solders for Microelectronics Packaging", Rev. Adv. Mater. Sci, 34, pp.185~ (2013)
  24. Santosh Kumar, "Wetting behavior and elastic properties of low alpha SAC105 and pure Sn solder", J. Mater. Sci. Tater. Electron, 24(6), pp.1748~ (2013)
  25. 김정수, "Sn-58Bi Solder와 OSP 표면 처리된 PCB의 접합강도에 미치는 시효처리와 에폭시의 영향", 마이크로전자 및 패키징학회지, 21(4), pp.97~103 (2014), 한국마이크로전자및패키징학회[DOI]

관련 논문AI추천

이 간행물의 다른 논문 (10건)