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참고문헌 (43)

1. IEEE Electronic Packaging Society, "Heterogenous Integration Roadmap 2021 Edition", IEEE, ~ (2021)
2. D. Kwon, "IoT-Based Prognostics and Systems Health Management for Industrial Applications", IEEE Access, 4 (2016)
3. Y. -J. Park, "A Review on Fault Detection and Process Diagnositics in Industrial Processes", MDPI Processes, 8 (2020)
4. A. Moradzadeh, "Data Mining Applications to Fault Diagnosis in Power Electronic Systems: A Systematic Review", IEEE Transactions on Power Electronics, 37(5) (2022)
5. W. G. Fenton, "Fault diagnosis of electronic systems using intelligent techniques:a review", IEEE Transactions on Systems, Man, and Cybernetics, Part C (Applications and Reviews), 31(3) (2001)
6. K. Chen, "Fault detection, classification and location for transmission lines and distribution systems:a review on the methods", High Voltage, 1(1) (2016)
7. H. Tanaka, "Introduction of Reliability Test Technology for Electronic Package", J. Microelectron. Packag. Soc, 19(1) (2012)
8. "Choosing a Maintenance Strategy Right for You" (2021)[URL]
9. F. Harada, "An Issue and Foresight for Accelerated Test in Reliability Engineering", J. Reliability Engineering Association of Japan, 31(2), pp.101~ (2009)
10. S. Suh, "Generative Oversampling Method for Imbalanced Data on Bearing Fault Detection and Diagnosis", Applied Sciences, 9(4) (2019)
11. 최주호, "건전성예측 및 관리기술 연구동향 및 응용사례", 항공우주시스템공학회지, 8(4), pp.7~17 (2014), 항공우주시스템공학회
12. 안다운, "Prediction of remaining useful life under different conditions using accelerated life testing data", Journal of Mechanical Science and Technology, 32(6), pp.2497~2507 (2018), 대한기계학회
13. A. Moradzadeh, "Data Mining Applications to Fault Diagnosis in Power Electronic Systems: A Systematic Review", IEEE Transactions on Power Electronics, 37(5) (2022)
14. H. Qi, "Analysis of Solder Joint Failure Criteria and Measurement Techniques in the Qualification of Electronic Products", IEEE Trans. on Components and Packaging Technologies, 31(2) (2008)
15. J. F. Caers, "A Study of Crack Propagation in Pb-free Solder Joints under Drop Impact", 2008 58th Electronic Components and Technology Conference (2008)
16. D. Kwon, "Detection of interconnect failure precursors using RF impedance analysis", Ph.D, pp.2010
17. A. K. M. M. Alam, "TDRBased Fault Detection in Grounding Electrodes Using a Rod Insertion Method", 2021 IEEE 19th International Symposium on Antenna Technology and Applied Electromagnetics (ANTEM) (2021)
18. D. Kwon, "Early detection of interconnect degradation by continuous monitoring of RF impedance", IEEE Transactions on device and materials reliability, 9(2) (2009)
19. N. J. Jameson, "Impedance-Based Condition Monitoring for Insulation Systems Used in Low-Voltage Electromagnetic Coils", IEEE Transactions on Industrial Electronics, 64(5) (2017)
20. K. Wang, "Degradation Monitoring of Insulation Systems Used in Low-Voltage Electromagnetic Coils under Thermal Loading Conditions from a Creep Point of View", Sensors, 20(13) (2020)
21. I. Shin, "Development of a non-invasive on-chip interconnect health sensing method based on bit error rates", Sensors, 18(10) (2018)
22. J. Lee, "A digital technique for diagnosing interconnect degradation by using digital signal characteristics", Microelectronics Journal, 60(C) (2017)
23. M. Waqar, "DDR4 Ball Grid Array Package Intermittent Fracture Effect on Signal Integrity", IEEE Transactions on Components, Packaging and Manufacturing Technology, 13(1) (2023)
24. J. Putaala, "Detection of Thermal Cycling-Induced Failures in RF", Microwave BGA Assemblies, 2008, pp.31(3), ~
25. S. Foley, "A Novel Fast Technique for Detecting Voiding Damage in IC Interconnects", Microelectronics Reliability, 40 (2000)
26. R. Ghaffarian, "Thermal Cycling Test Results of CSP and RF Package Assemblies", International Conference of Surface Mount Technology Association (2000)
27. T. Y. Kang, "Quantification of Performance Variation and Crack Evolution of Bond-Wire Interconnects Under Harsh Temperature Environments by SParameter Analysis", IEEE Transactions on Components, Packaging and Manufacturing Technology, 11(6) (2021)
28. D. Kwon, "Remaining-Life Prediction of Solder Joints Using RF Impedance Analysis and Gaussian Process Regression", IEEE Transactions on Components, Packaging and Manufacturing Technology, 5(11) (2015)
29. A. S. Narwariya, "Operational Age Estimation of ICs using Gaussian Process Regression", 2022 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), 2022 (2022)
30. C. Li, "Diagnosis and location of the open-circuit fault in modular multilevel converters:An improved machine learning method", Neurocomputing, 331 (2019)
31. M. Fei, "On-line fault diagnosis model for locomotive traction inverter based on wavelet transform and support vector machine", Microelectron. Rel, 88(90) (2018)
32. A. Martinez, "Online remaining useful lifetime prediction using support vector regression", IEEE Trans. Emerging Topics in Computing, 6 (2022)
33. N. T. Nguyen, "Fault diagnosis of voltage source inverter for induction motor drives using decision tree", Proc. Lecture Notes Elect. Eng, 398 (2017)
34. T. Y. Kang, "Reliability Assessment on Electrical Interconnects using S-parameter Pattern Analysis", Ph.D, pp.2021
35. G. H. Bazan, "Stator short-circuit diagnosis in induction motors using mutual information and intelligent systems", IEEE Trans. Ind. Electron, 66(4) (2019)
36. Z. Ke, "Single-submodule open-circuit fault diagnosis for a modular multi-level converter using artificial intelligentbased techniques", Proc. IEEE Appl. Power Electron. Conf. Expo (2019)
37. D. N. Coelho, "Detection of short circuit faults in 3-phase converter-fed induction motors using kernel SOMs", Proc. 12th Int. Workshop Self-Organizing Maps Learn, 12 (2017), Vector Quantization
38. Q. Lin, "Parametric fault diagnosis based on fuzzy cerebellar model neural networks", IEEE Trans. Ind. Electron (2019)
39. Q. Sun, "A novel fault diagnostic approach for DC-DC converters based on CSA-DBN", IEEE Access, 6 (2018)
40. L. Gaber, "Fault Detection based on Deep Learning for Digital VLSI Circuits", Procedia Computer Science, 194 (2021)
41. L. Xu, "Opencircuit fault diagnosis of power rectifier using sparse autoencoder based deep neural network", Neurocomputing, 311 (2018)
43. M. Raissi, "Physics-informed neural networks : A deep learning framework for solving forward and inverse problems involving nonlinear partial differential equations", Journal of Computational Physics, 378, pp.686~707 (2019)

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