갈륨과 Cu/Au 금속층과의 계면반응 연구
Study on the Interfacial Reactions between Gallium and Cu/Au Multi-layer Metallization
0
조회
0
다운로드
1
인용
0
참고문헌
키워드
초록
본 연구에서는 최근 저온접합 소재로 각광받고 있는 Ga과 대표적인 전극 물질인 Cu와의 반응연구를 실시하여 저온 솔더링 적용시 필요한 정보들을 확인하고자 하였다. 80-200oC 온도범위에서 Ga과 Cu/Au 기판을 반응시켜 계면반응 및 금속간화합물(IMC) 성장을 관찰하고 분석하였다. 반응계면에서 성장하는 주요한 IMC는 CuGa2 상이었으며 그상부에는 작은 입자크기를 가지는 AuGa2 IMC 그리고 하부에는 얇은 띠 형상의 Cu9Ga4 IMC가 형성되었다. CuGa2 입자들은 scallop 형상을 보이며 Cu6Sn5 성장의 경우와 비슷하게 반응시간이 증가함에 따라서 큰 형상변화없이 입자 크기가 증가하였다. CuGa2 성장기구를 분석한 결과 120-200oC 온도범위에서 시간지수는 약 3.0으로 산출되었고, 활성화에너지는 17.7 kJ/mol로 측정되었다.
Abstract
In this study, a reaction study between Ga, which has recently been spotlighted as a low-temperature bonding material, and Cu, a representative electrode material, was conducted to investigate information necessary for lowtemperature soldering applications. Interfacial reaction and intermetallic compound (IMC) growth were observed and analyzed by reacting Ga and Cu/Au substrates in the temperature range of 80-200oC. The main IMC growing at the reaction interface was CuGa2 phase, and AuGa2 IMC with small particle sizes was formed on the upper part and Cu9Ga4 IMC with a thin band shape on the lower part of the CuGa2 layer. CuGa2 particles showed a scallop shape, and the particle size increased without significant shape change as the reaction time increased, similar to the case of Cu6Sn5 growth. As a result of analyzing the CuGa2 growth mechanism, the time exponent was calculated to be ~3.0 in the temperature range of 120-200oC, and the activation energy was measured to be 17.7 kJ/mol.
참고문헌 (24)
- F. Gray, "Kirk‐Othmer Encyclopedia of Chemical Technology" (2000)
- M. D. Dickey, "Eutectic gallium‐indium (EGaIn): a liquid metal alloy for the formation of stable structures in microchannels at room temperature", Adv. Funct. Mater, 18(7), pp.1097~1104 (2008)
- J. R. Rumble, "CRC handbook of chemistry and physics" (2017), CRC Press
- V. Y. Prokhorenko, "Liquid gallium: potential uses as a heat-transfer agent", High Temperature, 38(6), pp.954~968 (2000)
- K. Kramer, "Effect of microtextured surface topography on the wetting behavior of eutectic gallium–indium alloys", Langmuir, 30(2), pp.533~539 (2014)
- M. D. Dickey, "Eutectic gallium-indium (egain): A liquid metal alloy for the formation of stable structures in microchannels at room temperature", Adv. Funct. Mater, 18(7), pp.1097~1104 (2008)
- D. Zrnic, "On the resistivity and surface tension of the eutectic alloy of gallium and indium", J. Alloys. Compd, 18(1), pp.67~68 (1969)
- M. D. Dickey, "Emerging applications of liquid metals featuring surface oxides", ACS. Appl. Mater. Interfaces, 6(21), pp.18369~18379 (2014)
- K. E. Spells, "The determination of the viscosity of liquid gallium over an extended nrange of temperature", Proceedings of the Physical Society (1926-1948), 48(2), pp.299~ (1936)
- J. H. Kim, "Cytotoxicity of Gallium–Indium Liquid Metal in Aqueous Environment", ACS. Appl. Mater. Interfaces, 10(20), pp.17448~17454 (2018)
- V. Y. Prokhorenko, "Liquid gallium: potential uses as a heat-transfer agent", High Temperature, 38(6), pp.954~968 (2000)
- T. Sawada, "Gallium-cooled liquid metallic-fueled fast reactor", Prog. Nucl. Energy, 37(1), pp.313~319 (2000)
- H. Ge, "Keeping smartphones cool with gallium phase change material", J. Heat. Transfer, 135(5) (2013)
- M. D. Dickey, "Stretchable and soft electronics using liquid metals", Adv. Mater, 29(27), pp.1606425~ (2017)
- K. Khoshmanesh, "Liquid metal enabled microfluidics", Lab. Chip, 17(6), pp.974~993 (2017)
- A. Tabatabai, "Liquidphase gallium–indium alloy electronics with microcontact printing", Langmuir, 29(20), pp.6194~6200 (2013)
- S. K. Lin, "Interfacial Reactions in Cu", Ga and Cu, Cu Couples, pp.J. Electron. Mater, 2014[DOI]
- Shih-kang Lin, "Formation of Solid-Solution Cu-to-Cu Joints Using Ga Solder and Pt under Bump Metallurgy for Three-Dimensional Integrated Circuits", Electronic Materials Letters, 11(4), pp.687~694 (2015), 대한금속·재료학회
- S. W. Chen, "Interfacial Reactions in the Cu", Ga, Ga, pp.Ni Samples, J. Electron. Mater[DOI]
- S. Liu, "Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of Cu-xNi", Ga, Intermetallics, pp.2021, 133[DOI]
- H. Okamoto, "Au-Ga (Gold-Gallium)", J. Phase Equilib. Diffus., 34(2), pp.174~175 (2013)
- J. B. Li, "A thermodynamic assessment of the copper–gallium system", Calphad, 32(2), pp.447~453 (2008)
- M. Schaefer, "Theory for intermetallic phase growth between Cu and liquid Sn-Pb solder based on grain boundary diffusion control", J. Electron. Mater, 27(11), pp.1167~1176 (1998)
- H. K. Kim, "Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening", Phys. Rev. B, 53(23), pp.16027~ (1996)