Copper 함량에 따른 Mo-Cu-N 박막의 미세구조 변화에 대한 연구
Microstructural Evolution of Mo-Cu-N Films as a Function of Copper Content
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Ternary Mo-Cu-N films were deposited on Si wafer substrates with various copper contents by magnetron sputtering method using Mo target and Cu target in Ar/N2 gaseous atmosphere. As increasing N2 pressure, the microstructure of Mo-N films changed from γ-Mo2N of (111) having face-centered-cubic (FCC) structure to δ-MoN of (200) having hexagonal structure. Detailed the microstructures of the Mo-Cu-N coatings were studied by X-ray diffraction, scanning electron microscopy and field emission transmission electron micro-scope. The results indicated that the incorporation of copper into the growing Mo-N coating led to the Mo2N and MoN crystallites were more well-distributed and refined and the copper existed in grain boundary. Ternary Mo-Cu-N films had a composite microstructure of the nanosized crystal crystalline γ-Mo2N and δ-MoN surrounded by amorphous Cu3N phase.
Abstract
Ternary Mo-Cu-N films were deposited on Si wafer substrates with various copper contents by magnetron sputtering method using Mo target and Cu target in Ar/N2 gaseous atmosphere. As increasing N2 pressure, the microstructure of Mo-N films changed from γ-Mo2N of (111) having face-centered-cubic (FCC) structure to δ-MoN of (200) having hexagonal structure. Detailed the microstructures of the Mo-Cu-N coatings were studied by X-ray diffraction, scanning electron microscopy and field emission transmission electron micro-scope. The results indicated that the incorporation of copper into the growing Mo-N coating led to the Mo2N and MoN crystallites were more well-distributed and refined and the copper existed in grain boundary. Ternary Mo-Cu-N films had a composite microstructure of the nanosized crystal crystalline γ-Mo2N and δ-MoN surrounded by amorphous Cu3N phase.
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