피로인산동욕의 무기첨가제에 의한 전해동박의 특성에 관한 연구
Study on Characteristics of Electrodeposited Thin Copper Film by Inorganic Additives in Pyrophosphate Copper Plating Bath
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The copper deposit on steel plate was prepared by pyrophosphate copper plating solution made with variationof inorganic additive. NH4OH and NH4NO3 were used as inorganic additives. The copper layer characteristics- tensile strength, crystallite size and crystal orientation - were evaluated by X-ray diffraction and UniversalTest Machine. The presence of ammonium nitrate results in reduction of average roughness value from 0.08 μmto 0.03 μm. In pyrophosphate copper plating solution without Inorganic additive, tensile strength of electrodepositcopper foil was reduced from 600 MPa to 180 MPa after 7 days aging. However, when addingammonium nitrate, there was almost no change of tensile strength, intensity of crystal orientation - (111),(200) and (220) - and crystallite size (2~30 nm).
Abstract
The copper deposit on steel plate was prepared by pyrophosphate copper plating solution made with variationof inorganic additive. NH4OH and NH4NO3 were used as inorganic additives. The copper layer characteristics- tensile strength, crystallite size and crystal orientation - were evaluated by X-ray diffraction and UniversalTest Machine. The presence of ammonium nitrate results in reduction of average roughness value from 0.08 μmto 0.03 μm. In pyrophosphate copper plating solution without Inorganic additive, tensile strength of electrodepositcopper foil was reduced from 600 MPa to 180 MPa after 7 days aging. However, when addingammonium nitrate, there was almost no change of tensile strength, intensity of crystal orientation - (111),(200) and (220) - and crystallite size (2~30 nm).
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