에틸렌디아민을 착화제로 사용하는 팔라듐-니켈 합금도금
Palladium-Nickel Alloy Electrodeposition Using Ethylenediamine as Complexing Agent
1
조회
0
다운로드
1
인용
0
참고문헌
키워드
초록
Electrodeposition behaviors of Pd-Ni alloys were investigated from the polarization curves in a solution containing ethylenediamine as complexing agent. The microstructure and hardness of electrodeposited Pd-Ni alloys were also characterized. Codeposition of Pd-Ni alloys was successfully performed in the wide current density ranging from 2 to 5000 A·m−2 because the deposition potential of Pd became close to that of Ni in the ethylenediamine-contained solution. It was also found from X-ray diffraction patterns that the solid solution between Pd and Ni was formed with variation of the composition of alloys. The measured hardness of Pd-Ni alloys increased with increasing the contents of Ni due to solid solution strengthening and grain refinement. The electrodeposited Pd-Ni alloys also exhibited a crack free smooth surface morphology from the SEMobservation.
Abstract
Electrodeposition behaviors of Pd-Ni alloys were investigated from the polarization curves in a solution containing ethylenediamine as complexing agent. The microstructure and hardness of electrodeposited Pd-Ni alloys were also characterized. Codeposition of Pd-Ni alloys was successfully performed in the wide current density ranging from 2 to 5000 A·m−2 because the deposition potential of Pd became close to that of Ni in the ethylenediamine-contained solution. It was also found from X-ray diffraction patterns that the solid solution between Pd and Ni was formed with variation of the composition of alloys. The measured hardness of Pd-Ni alloys increased with increasing the contents of Ni due to solid solution strengthening and grain refinement. The electrodeposited Pd-Ni alloys also exhibited a crack free smooth surface morphology from the SEMobservation.
참고문헌 (20)
- C. S. Back, , Kor. Inst. Surf. Eng, 25, pp.107~ (1992)
- J. G. Han, , Kor. Inst. Surf. Eng, 25, pp.309~ (1992)
- M. Antler, "IEEE Trans. Components", Hybrids, Manuf. Technol, CHMT-10, pp.420~ (1987)
- H. S. Yu, , J. Adv. Navig. Technol, 18(4), pp.381~ (2014)
- S. Umemura, , IEEE Trans. Comp., Hybrids, Manuf., Technol, 14, pp.181~ (1991)
- J. P. Yue, , Trans. Inst. Met. Fin, 64(2), pp.62~ (1986)
- S. Uemiya, , Mater, Trans, 48(5), pp.1119~ (2007)
- J. A. Abys, , Plat. and Surf. Fin, 86, pp.108~ (1998)
- Z. Ratajewicz, , Plat. and Surf. Fin, 84(11), pp.60~ (1997)
- J. A. Abys, , Plat. and Surf. Fin, 83, pp.43~ (1996)
- P. Wikinson, , Trans. Inst. Met. Fin, 60(4), pp.152~ (1982)
- K. J. Whitlaw, , Trans. Inst. Met. Fin, 60(4), pp.141~ (1982)
- A. H. Graham, , Plating, 70(11), pp.52~ (1983)
- Y. Fukumoto, , Plat. and Surf. Fin, 73(3), pp.62~ (1986)
- W. Zhang, , Met. Fin, 107, pp.22~ (2009)
- S. Berger, , Met. Fin, 108, pp.29~ (2010)
- A. Brenner, "Electrodeposition of Alloys, Vols. 1&2", pp.76~ (1963), Academic Press
- J. A. Abys, , J. Blee, Met. Fin, 89, pp.43~ (1991)
- R. Dedoncker, , Trans. Inst. Met. Fin, 63, pp.59~ (1985)
- R. G. Baker, , Plating, 58(8), pp.791~ (1971)