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열처리 시간에 따른 Ni-P/Cr 이중 도금 층의 계면 거동에 관한 연구

Effect of Heat Treatment on Interface Behavior in Ni-P/Cr Double Layer

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초록

The thermal barrier coating (TBC) for inner wall of liquid-fuel rocket combustor consists of NiCrAlY as bonding layer and ZrO2 as a top layer. In most case, the plasma spray coating is used for TBC process and this process has inherent possibility of cracking due to large difference in thermal expansion coefficients among bonding layer, top layer and metal substrate. In this paper, we suggest crack-free TBC process by using a precise electrodeposition technique. Electrodeposited Ni-P/Cr double layer has similar thermal expansion coefficient to the Cu alloy substrate resulting in superior thermal barrier performance and high temperature oxidation resistance. We studied the effects of phosphorous concentrations (2.12 wt%, 6.97 wt%, and 10.53 wt%) on the annealing behavior (750oC) of Ni-P samples and Cr double layered electrodeposits. Annealing temperature was simulated by combustion test condition. Also, we conducted SEM/EDS and XRD analysis for Ni-P/Cr samples. The results showed that the band layers between Ni-P and Cr are Ni and Cr, and has no formed with heat treatment. These band layers were solid solution of Cr and Ni which is formed by interdiffusion of both alloy elements. In addition, the P was not found in it. The thickness of band layer was increased with increasing annealing time. We expected that the band layer can improve the adhesion between Cr and Ni-P.

Abstract

The thermal barrier coating (TBC) for inner wall of liquid-fuel rocket combustor consists of NiCrAlY as bonding layer and ZrO2 as a top layer. In most case, the plasma spray coating is used for TBC process and this process has inherent possibility of cracking due to large difference in thermal expansion coefficients among bonding layer, top layer and metal substrate. In this paper, we suggest crack-free TBC process by using a precise electrodeposition technique. Electrodeposited Ni-P/Cr double layer has similar thermal expansion coefficient to the Cu alloy substrate resulting in superior thermal barrier performance and high temperature oxidation resistance. We studied the effects of phosphorous concentrations (2.12 wt%, 6.97 wt%, and 10.53 wt%) on the annealing behavior (750oC) of Ni-P samples and Cr double layered electrodeposits. Annealing temperature was simulated by combustion test condition. Also, we conducted SEM/EDS and XRD analysis for Ni-P/Cr samples. The results showed that the band layers between Ni-P and Cr are Ni and Cr, and has no formed with heat treatment. These band layers were solid solution of Cr and Ni which is formed by interdiffusion of both alloy elements. In addition, the P was not found in it. The thickness of band layer was increased with increasing annealing time. We expected that the band layer can improve the adhesion between Cr and Ni-P.

참고문헌 (11)

  1. David, Henry C., "Loewentha l" (2007), NASA Technical Memorandum
  2. Sutton, George P., "Rocket propulsion elements" (2010), John Wiley & Sons
  3. H. R. Cho, , Korea Society of Propulsion Engineers, 11, pp.1~ (2009)
  4. G. B. Park, , Journal of the Korea Institute of Surface Engineering, 35, pp.2~ (2002)
  5. Anju M. Pillai, , Journal of Coatings Technology and Research, 9, pp.6~ (2012)
  6. Lin, , Journal of alloys and compounds, 439, pp.1~ (2007)
  7. He, Y. D, , Scripta Materialia, 58, pp.6~ (2008)
  8. D. Nava, , Int. J. Electrochem. Sci, 8 (2013)
  9. Song. Jinxiang, , X-Ray Absorption Fine Structure (XAFS), 13, pp.882~ (2007)
  10. H. T. Yeom, "The Surface finishing of metal" (2011), The dongmyungsa
  11. Mallory, Glenn O., "Electroless Plating, Fundamentals and Applications" (1990), William Andrew

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