열전도성 입자를 활용한 시트용 점착제의 점착 특성과 방열특성 연구
Comparative Analysis of Heat Sink and Adhesion Properties of Thermal Conductive Particles for Sheet Adhesive
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초록
Improvement of heat sink technology related to the continuous implementation performance and extension of device-life in circumstance of easy heating and more compact space has been becoming more important issue as multi-functional integration and miniaturization trend of electronic gadgets and products has been generalized. In this study, it purposed to minimize of decline of the heat diffusivity by gluing polymer through compounding of inorganic particles which have thermal conductive properties. We used NH-9300 as Base resin and used inorganic fillers such as silicon carbide(SiC), aluminum nitride(AIN), and boron nitride(BN) to improve heat diffusivity. After making film which was made from 100 part of acrylic resin mixed hardener(1.0 part more or less) with inorganic particles. The film was matured at 80℃ for 24h. Diffusivity were tested according to sorts of particles and density of particles as well as size and structure of particle to improve the effect of heat sink in view of morphology assessing diffusivity by LFA (Netzsch/ LFA 447 Nano Flash) and adhesion strength by UTM (Universal Testing Machine). The correlation between diffusivity of pure inorganic particles and composite as well as the relation between density and morphology of inorganic particles has been studied. The study related morphology showed that globular type had superior diffusivity at low density of 25% but on the contarary globular type was inferior to non-globular type at high density of 80%.
Abstract
Improvement of heat sink technology related to the continuous implementation performance and extension of device-life in circumstance of easy heating and more compact space has been becoming more important issue as multi-functional integration and miniaturization trend of electronic gadgets and products has been generalized. In this study, it purposed to minimize of decline of the heat diffusivity by gluing polymer through compounding of inorganic particles which have thermal conductive properties. We used NH-9300 as Base resin and used inorganic fillers such as silicon carbide(SiC), aluminum nitride(AIN), and boron nitride(BN) to improve heat diffusivity. After making film which was made from 100 part of acrylic resin mixed hardener(1.0 part more or less) with inorganic particles. The film was matured at 80℃ for 24h. Diffusivity were tested according to sorts of particles and density of particles as well as size and structure of particle to improve the effect of heat sink in view of morphology assessing diffusivity by LFA (Netzsch/ LFA 447 Nano Flash) and adhesion strength by UTM (Universal Testing Machine). The correlation between diffusivity of pure inorganic particles and composite as well as the relation between density and morphology of inorganic particles has been studied. The study related morphology showed that globular type had superior diffusivity at low density of 25% but on the contarary globular type was inferior to non-globular type at high density of 80%.
참고문헌 (13)
- R. Viswanath, "Thermal Performance Challenges from Silicon to System", Intel. Technol. J., Q3, pp.1~ (2000)
- K. C. Yung, "Thermal Performance of High Brightness LED Array Package on PCB", Int. Commun. Heat Mass Transfer., 37, pp.1266~ (2010)
- R. Liu, "Thermal Optimization of GaNon SiHEMTs with Plastic Packaging", Microelectron. Reliab, 51, pp.1788~ (2011)
- G. Sui, "Dielectric Properties andConductivity ofCarbon Nanofiber", semi-crystalline Polymer Composites, 2008, pp.56, 2381~
- D. D. L. Chung, "Thermal InterfaceMaterials", J. Mater. Eng. Perform, 10, pp.56~ (2001)
- X. C. Tong, "Advanced Materials for Thermal Management of Electronic Packaging", pp.30~ (2011), Springer
- W. J. Parker, "FlashMethod ofDetermining ThermalDiffusivity, Heat Capacity, and Thermal Conductivity", J. Appl. Phys, 32, pp.1679~ (1961)
- "ASTMD3330-96, Standard TestMethod for PeelAdhesion of Pressure Sensitive Tape at 180° Angle", ~ (1997)
- R. E. Newnham, "Connectivity and Piezoelectric Pyroelectric Composites", Mater. Res. Bull, 13, pp.525~ (1978)
- W. Zhou, "Effect of the Particle Size of Al2O3 on the Properties of FilledHeat-conductive SiliconeRubber", J. Appl. Polym. Sci, 104, pp.1312~ (2007)
- Q. Mu, "Thermal Conductivity of Silicone Rubber Filled with ZnO", Polym. Comos, 28, pp.125~ (2007)
- 서희성, "Particle Size, Morphology and Color Characteristics of C.I. Pigment Red 57:1 : 1. Effect of Synthesis Conditions", 한국염색가공학회지, 27(4), pp.229~244 (2015), 한국염색가공학회
- 서희성, "Particle Size, Morphology and Color Characteristics of C.I. Pigment Red 57:1 : 2. Effect of Salt Milling Process", 한국염색가공학회지, 27(4), pp.245~260 (2015), 한국염색가공학회